Behavior of tin whisker formation and growth on lead-free solder finish

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 350-354

  Kim, Kyung Seob ^a   Yu, Chung Hee ^b   Yang, Jun Mo ^c  

^a Yeojoo Institute of Technology   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c National Nano Fab Center (NNFC)   (South Korea)

Author keywords

Ambient storage; Lead free finish; Temperature cycling; Tin whisker

Indexed keywords

COMPOSITION; GROWTH KINETICS; INTERFACES (MATERIALS); SOLDERING ALLOYS; THERMAL EXPANSION; TIN;

AMBIENT STORAGE; LEAD-FREE FINISHES; TEMPERATURE CYCLING; TIN WHISKERS;

CRYSTAL WHISKERS;

EID: 33644925267     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.088     Document Type: Conference Paper

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