Humidity effects on Sn whisker formation

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 4, 2006, Pages 239-245

  Oberndorff, Pascal ^a   Dittes, Marc ^b   Crema, Paolo ^c   Su, Peng ^d   Yu, Elton ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c STMICROELECTRONICS   (Italy)

^d FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Electroplating; Humidity; Matte Sn; Whisker

Indexed keywords

ATMOSPHERIC HUMIDITY; CORROSION; CRYSTAL WHISKERS; METALLIZING; OXIDATION; TIN;

BOARD ASSEMBLY; HUMIDITY EFFECTS; WHISKER FORMATION; WHISKER GROWTH;

ELECTROPLATING;

EID: 33846866285     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.887358     Document Type: Article

References (15)

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