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Volumn 30, Issue 1, 2007, Pages 36-40

Length distribution analysis for tin whisker growth

Author keywords

Annealing; Density; Length; Matte Sn; Reflow; Tin whiskers

Indexed keywords

ANNEALING; CRYSTAL GROWTH; CRYSTAL WHISKERS; DENSITY MEASUREMENT (SPECIFIC GRAVITY); SEMICONDUCTOR DEVICES;

EID: 34047149305     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.890638     Document Type: Article
Times cited : (14)

References (39)
  • 2
    • 10444219851 scopus 로고    scopus 로고
    • "Directive 2002/95/EC/ of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment"
    • Feb. 13, [Online]. Available
    • "Directive 2002/95/EC/ of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment," Official J. Eur. Union, pp. L37/19-L37/23, Feb. 13, 2003 [Online]. Available: http://europa.eu.int/eurlex/pri/en/oj/dat/2003/1_037/ 1_03720030213en00190023.pdf
    • (2003) Official J. Eur. Union
  • 3
    • 14644415927 scopus 로고    scopus 로고
    • "The impact of lead-free legislation exemptions on the electronics industry"
    • Oct
    • M. Pecht, Y. Fukuda, and S. Rajagopal, "The impact of lead-free legislation exemptions on the electronics industry," IEEE Trans. Electron. Packag. Manuf., vol. 27, no. 4, pp. 221-232, Oct. 2004.
    • (2004) IEEE Trans. Electron. Packag. Manuf. , vol.27 , Issue.4 , pp. 221-232
    • Pecht, M.1    Fukuda, Y.2    Rajagopal, S.3
  • 4
    • 33646359934 scopus 로고    scopus 로고
    • "Impact of environmental regulations on green electronic manufacture"
    • R. Ciocci and M. Pecht, "Impact of environmental regulations on green electronic manufacture," Microelectron. Int., vol. 23, no. 2, pp. 45-50, 2006.
    • (2006) Microelectron. Int. , vol.23 , Issue.2 , pp. 45-50
    • Ciocci, R.1    Pecht, M.2
  • 6
    • 0038140902 scopus 로고    scopus 로고
    • "Tin whisker observations on pure tin-plated ceramic chip capacitors"
    • in Orlando, FL, Jun
    • J. A. Brusse, "Tin whisker observations on pure tin-plated ceramic chip capacitors," in Proc. AESF SUR/FIN, Orlando, FL, Jun. 2002, pp. 45-61.
    • (2002) Proc. AESF SUR/FIN , pp. 45-61
    • Brusse, J.A.1
  • 7
    • 34047179453 scopus 로고    scopus 로고
    • "Report of International Electronics Manufacturing Initiative"
    • iNEMI, May [Online]. Available: "Recommendations on Lead-free Finishes for Components Used in High-Reliability Products," (reviewed on 16 May 2005)
    • "Report of International Electronics Manufacturing Initiative," iNEMI, May 2005 [Online]. Available: http://thor.inemi.org/webdownload/projects/ese/tin_whiskers/ User_Group_mitigation_May05.pdf, "Recommendations on Lead-free Finishes for Components Used in High-Reliability Products," (reviewed on 16 May 2005)
    • (2005)
  • 8
    • 34047114401 scopus 로고    scopus 로고
    • "Status of proposed IEC whisker test methodologies"
    • JEITA Lead-Free Project Rep., Feb
    • I. Sakamoto, "Status of proposed IEC whisker test methodologies," JEITA Lead-Free Project Rep., pp. 15-27, Feb. 2005.
    • (2005) , pp. 15-27
    • Sakamoto, I.1
  • 9
    • 5444244980 scopus 로고    scopus 로고
    • "Avoiding tin whisker reliability problems"
    • Aug
    • G. T. Galyon and R. Gedney, "Avoiding tin whisker reliability problems," Circuits Assembly, pp. 26-31, Aug. 2004.
    • (2004) Circuits Assembly , pp. 26-31
    • Galyon, G.T.1    Gedney, R.2
  • 10
    • 33645142343 scopus 로고    scopus 로고
    • "Field reliability estimation of tin whiskers generated by thermal-cycling stress"
    • Murata Manufacturing Co., Kyoto, Japan
    • S. Okada, S. Higuchi, and T. Ando, "Field reliability estimation of tin whiskers generated by thermal-cycling stress," Murata Manufacturing Co., Kyoto, Japan, 2003.
    • (2003)
    • Okada, S.1    Higuchi, S.2    Ando, T.3
  • 13
    • 0006042060 scopus 로고
    • "A tentative theory of metallic whisker growth"
    • J. D. Eshelby, "A tentative theory of metallic whisker growth," Phys. Rev., vol. 91, pp. 755-756, 1953.
    • (1953) Phys. Rev. , vol.91 , pp. 755-756
    • Eshelby, J.D.1
  • 14
    • 46149143690 scopus 로고    scopus 로고
    • "Recrystallization principles applied to whisker growth in tin"
    • in Mar
    • I. Boguslavsky and P. Bush, "Recrystallization principles applied to whisker growth in tin," in Proc. IPC/SMEMA Council APEX2003, Mar. 2003, pp. S12-4-1-S12-4-10.
    • (2003) Proc. IPC/SMEMA Council APEX2003
    • Boguslavsky, I.1    Bush, P.2
  • 17
    • 0032083872 scopus 로고    scopus 로고
    • "Spontaneous growth mechanism of tin whiskers"
    • B. Lee and D. Lee, "Spontaneous growth mechanism of tin whiskers," Acta Mater., vol. 46, no. 10, pp. 3701-3714, 1998.
    • (1998) Acta Mater. , vol.46 , Issue.10 , pp. 3701-3714
    • Lee, B.1    Lee, D.2
  • 20
    • 0038739561 scopus 로고
    • "A laboratory study of tin whisker growth"
    • Sep
    • B. Dunn, "A laboratory study of tin whisker growth," Eur. Space Agency STR-223, pp. 1-50, Sep. 1987.
    • (1987) Eur. Space Agency STR-223 , pp. 1-50
    • Dunn, B.1
  • 21
    • 0016073268 scopus 로고
    • "Spontaneous growth of whiskers on tin coatings: 20 years of observation"
    • Apr
    • S. Britton, "Spontaneous growth of whiskers on tin coatings: 20 years of observation," Trans. Inst. Metal Finishing, vol. 52, pp. 95-102, Apr. 1974.
    • (1974) Trans. Inst. Metal Finishing , vol.52 , pp. 95-102
    • Britton, S.1
  • 22
    • 46149150147 scopus 로고
    • "Study of tin whiskers on electromagnetic relay parts"
    • in Stillwater, OK, Apr. 25-26
    • Y. Hada, O. Morikawa, and H. Togami, "Study of tin whiskers on electromagnetic relay parts," in Proc. 26th Annu. Relay Conf., Stillwater, OK, Apr. 25-26, 1978, pp. 9-1-9-15.
    • (1978) Proc. 26th Annu. Relay Conf.
    • Hada, Y.1    Morikawa, O.2    Togami, H.3
  • 24
    • 84920858878 scopus 로고    scopus 로고
    • "An investigation into methods for minimizing tin whisker growth"
    • in Jun
    • K. Whitlaw and J. Crosby, "An investigation into methods for minimizing tin whisker growth," in Proc. AFSF SUR/FIN, Jun. 2003, pp. 289-298.
    • (2003) Proc. AFSF SUR/FIN , pp. 289-298
    • Whitlaw, K.1    Crosby, J.2
  • 25
    • 0038479808 scopus 로고    scopus 로고
    • "Tin whisker growth and prevention"
    • Oct
    • Y. Zhang, C. Xu, C. Fan, and J. Abys, "Tin whisker growth and prevention," J. Surface Mount Technol., vol. 13, no. 4, pp. 1-9, Oct. 2000.
    • (2000) J. Surface Mount Technol. , vol.13 , Issue.4 , pp. 1-9
    • Zhang, Y.1    Xu, C.2    Fan, C.3    Abys, J.4
  • 26
    • 34047163475 scopus 로고    scopus 로고
    • "Role of intrinsic stresses in phenomena of tin whiskers in electrical contacts"
    • in Las Vegas, NV, Jun. 1-2
    • S. Lal and T. Moyer, "Role of intrinsic stresses in phenomena of tin whiskers in electrical contacts," in Proc. Electron. Compon. Technol. Conf., Las Vegas, NV, Jun. 1-2, 2004, pp. 1-46.
    • (2004) Proc. Electron. Compon. Technol. Conf. , pp. 1-46
    • Lal, S.1    Moyer, T.2
  • 27
    • 34047187477 scopus 로고
    • "ITG subject: Tin whiskers-problems, causes, and solutions"
    • Department of Health, Education, and Welfare Public Health Service Drug Administration, Rep. No. 42, Mar. [Online]. Available: (reviewed on 1 June 2004)
    • "ITG subject: Tin whiskers-problems, causes, and solutions," Department of Health, Education, and Welfare Public Health Service Drug Administration, Rep. No. 42, Mar. 1986 [Online]. Available: http://www.fda.gov/ora/inspect_ref/itg/itg42.html, (reviewed on 1 June 2004)
    • (1986)
  • 29
    • 20444363241 scopus 로고
    • "A study of the influence of certain factors on the growth of filamentary tin crystals"
    • Sep.-Oct
    • V. Glazunova, "A study of the influence of certain factors on the growth of filamentary tin crystals," Kristallografiya, vol. 7, no. 5, pp. 761-768, Sep.-Oct. 1962.
    • (1962) Kristallografiya , vol.7 , Issue.5 , pp. 761-768
    • Glazunova, V.1
  • 30
    • 34047174050 scopus 로고    scopus 로고
    • "IBM server and storage system's environmental requirements for purchased electronic components"
    • IBM Engineering Specification Document Number: 77P0594, EC: J33709, Oct. 28
    • "IBM server and storage system's environmental requirements for purchased electronic components," IBM Engineering Specification Document Number: 77P0594, EC: J33709, Oct. 28, 2004.
    • (2004)
  • 31
    • 33748298817 scopus 로고    scopus 로고
    • "Tin whisker risk assessment"
    • May
    • T. Fang, M. Osterman, S. Mathew, and M. Pecht, "Tin whisker risk assessment," Circuit World, vol. 32, no. 3, pp. 25-29, May 2007.
    • (2007) Circuit World , vol.32 , Issue.3 , pp. 25-29
    • Fang, T.1    Osterman, M.2    Mathew, S.3    Pecht, M.4
  • 32
    • 33645136360 scopus 로고    scopus 로고
    • "Statistical analysis of tin whisker growth"
    • May/Jun
    • T. Fang, M. Osterman, and M. Pecht, "Statistical analysis of tin whisker growth," Microelectron. Rel., vol. 46, no. 5-6, pp. 846-849, May/Jun. 2006.
    • (2006) Microelectron. Rel. , vol.46 , Issue.5-6 , pp. 846-849
    • Fang, T.1    Osterman, M.2    Pecht, M.3
  • 33
    • 33845889089 scopus 로고    scopus 로고
    • "Assessing tin whisker risk in electronic products"
    • May
    • T. Fang, S. Mathew, M. Osterman, and M. Pecht, "Assessing tin whisker risk in electronic products," SMT Mag., vol. 20, no. 5, pp. 24-25, May 2007.
    • (2007) SMT Mag. , vol.20 , Issue.5 , pp. 24-25
    • Fang, T.1    Mathew, S.2    Osterman, M.3    Pecht, M.4
  • 35
    • 33845383438 scopus 로고    scopus 로고
    • "The impact of electrical current, mechanical bending, and thermal annealling on tin whisker growth"
    • Y. Fukuda, M. Osterman, and M. Pecht, "The impact of electrical current, mechanical bending, and thermal annealling on tin whisker growth," Microelectron. Rel., vol. 47, pp. 88-92, 2007.
    • (2007) Microelectron. Rel. , vol.47 , pp. 88-92
    • Fukuda, Y.1    Osterman, M.2    Pecht, M.3
  • 36
    • 34047123688 scopus 로고    scopus 로고
    • "Tin whiskers: What's the risk?"
    • in Tulsa, OK: PennWell, Jun
    • Y. Fukuda and M. Osterman, "Tin whiskers: What's the risk?," in Lead Free Electron.. Tulsa, OK: PennWell, Jun. 2005.
    • (2005) Lead Free Electron.
    • Fukuda, Y.1    Osterman, M.2
  • 37
    • 29244437726 scopus 로고    scopus 로고
    • "Effect of Heat Treatment on Tin Whisker Growth"
    • in Chicago, IL, Sep. 26-30
    • Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, "Effect of Heat Treatment on Tin Whisker Growth," in Proc. Int. SMTA Conf., Chicago, IL, Sep. 26-30, 2004, pp. 717-723.
    • (2004) Proc. Int. SMTA Conf. , pp. 717-723
    • Fukuda, Y.1    Fang, T.2    Pecht, M.3    Osterman, M.4
  • 38
    • 33845704564 scopus 로고    scopus 로고
    • "Electrical influence on tin whisker growth"
    • Sep
    • Y. Fukuda, M. Osterman, and M. Pecht, "Electrical influence on tin whisker growth," SMT Mag., vol. 20, no. 9, pp. 41-42, Sep. 2006.
    • (2006) SMT Mag. , vol.20 , Issue.9 , pp. 41-42
    • Fukuda, Y.1    Osterman, M.2    Pecht, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.