Tin whisker formation of lead-free plated leadframes

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1080-1086

  Kim, K S ^a   Yu, C H ^b   Yang, J M ^c  

^a Yeojoo Institute of Technology   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c National Nano Fab Center (NNFC)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL GROWTH; INTERMETALLICS; LEAD; RELIABILITY THEORY; SEMICONDUCTING TIN COMPOUNDS; THERMAL CYCLING; THERMAL EXPANSION;

LEAD-FREE FINISH MATERIALS; PLATING TEMPERATURE; THERMAL EXPANSION MISMATCH; WHISKER GROWTH;

CRYSTAL WHISKERS;

EID: 33646350276     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1007/11753810_90     Document Type: Article

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