Effects of reflow on the microstructure and whisker growth propensity of Sn finish

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 434-440

  Su, Peng ^a   Ding, Min ^a   Chopin, Sheila ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC LATTICES; MICROELECTRONICS INDUSTRY; WHISKER GROWTH;

ELECTRONICS PACKAGING; LEAD; MICROELECTRONICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; TIN ALLOYS;

CRYSTAL WHISKERS;

EID: 24644450758     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Test Method for Evaluating Tin Whisker Growth on Plated Surfaces, [online], http://www.nemi.org/
2. Ravelo, R., et al, "Equilibrium and thermodynamic properties of grey, white, and liquid tin," Physical Review Letters, Vol. 79, No. 13 (1997), pp. 2482-2485.
3. Barsoum, M.W., et al, "Driving force and mechanism for spontaneous metal whisker formation," Physical Review Letters, Vol. 93, No. 20 (2004), pp. 206104-1-206104-4