Interdiffusion and phase formation in Cu(Sn) alloy films

Journal of Applied Physics

Volumn 83, Issue 1, 1998, Pages 90-99

  Clevenger, L A ^e   Arcot, B ^a,e   Ziegler, W ^b,e   Colgan, E G ^e   Hong, Q Z ^c,e   D'Heurle, F M ^d,e   Cabral Jr , C ^e   Gallo, T A ^e   Harper, J M E ^e  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF TÜBINGEN   (Germany)

^c TEXAS INSTRUMENTS   (United States)

^d ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^e IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001996169     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.366728     Document Type: Article

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