Effects of hydrogen plasma treatments on the atomic layer deposition of copper

Electrochemical and Solid-State Letters

Volumn 11, Issue 5, 2008, Pages

  Wu, L ^a,b   Eisenbraun, E ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC LAYER DEPOSITION; HYDROGEN; NUCLEATION; PLASMA APPLICATIONS;

HYDROGEN PLASMA TREATMENTS; NANOELECTRONIC INTERCONNECT STRUCTURES;

COPPER;

EID: 40849083726     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2844207     Document Type: Article

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