Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS)

Thin Solid Films

Volumn 375, Issue 1-2, 2000, Pages 132-136

  Lee, Jong Hyun ^a   Lee, Jeong Hwan ^a   Hwang, Ki Ju ^a   Kim, Jung Yeul ^b   Suk, Chang Gil ^c   Choi, Sie Young ^a  

^a Kyungpook National University   (South Korea)

^b Uiduk University   (South Korea)

^c Ultec Technology Lab   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; HYDROGEN; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SUBSTRATES; THERMAL EFFECTS;

REMOTE HYDROGEN PLASMA PRETREATMENT;

METALLIC FILMS;

EID: 0342538893     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01255-4     Document Type: Article

References (15)

1. Nuesca G.M., Kelber J.A. Thin Solid Films. 262:1995;224.
2. Gelatos A.V., Marsh R., Kottke M., Mogab C.J. Appl. Phys. Lett. 63:1993;2843.
3. Takamori A., Sugata S., Asakawa A., Miyauchi E., Hashimoto H. Jpn. J. App. Phys. 26:1982;L142.
4. Prasad J., Nuesca G.M., Kelber J.A. Appl. Surf. Sci. 74:1994;115.
5. Zheng B., Eisenbraun E.T., Liu J., Kaloyeros A.E. Appl. Phys. Lett. 61:1992;2175.
6. Norman J.A.T., Muratore B.A., Dyer P.N., Roberts D.A., Hochberg A.K. Thin Solid Films. 262:1995;46.
7. Jain A., Chi K.M., Hampden-Smith M.J., Kodas T.T. J. Electrochem. Soc. 140:1995;1434.
8. Nguyen T., Charneski L.J., Hsu S.T. J. Electrochem. Soc. 144:1997;2829.
9. Awaya N., Ohno K., Arita Y. J. Electrochem. Soc. 142:1995;3173.
10. Oehr C., Suhr H. Appl. Phys. A: Solids Surf. 45:1988;151.
11. Lakshmanan S.K., Gill W.N. J. Vac. Sci. Technol. A. 16:1998;2187.
12. Lakshmanan S.K., Gill W.N. J. Electochem. Soc. 145:1998;694.
13. Shiratani S.M., Kawasaki H., Fukuzawa T., Kinoshita T., Watanabe Y. J. Phys. D. 29:1996;2754.
14. Lee J-H., Park B.N., Park S.J., Choi S.Y. J. Korean Phys. Sci. 33:1998;S59.
15. Bauer E. Thin Solid Films. 12:1992;167.