Hydrogen plasma-enhanced atomic layer deposition of copper thin films

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 2581-2585

  Wu, Liqi ^a   Eisenbraun, Eric ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER THIN FILMS; PLASMA-ENHANCED ATOMIC LAYER DEPOSITION (PEALD);

ATOMIC LAYER DEPOSITION; AUGER ELECTRON SPECTROSCOPY; COPPER; FILM GROWTH; HYDROGEN;

THIN FILMS;

EID: 37149051835     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2779050     Document Type: Article

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