Integration of electrochemically deposited Cu on plasma enhanced atomic layer deposition-grown Cu seed layers

ECS Transactions

Volumn 11, Issue 7, 2007, Pages 67-78

  Wu, L ^a   Zeng, W ^a   Eisenbraun, E ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC LAYER DEPOSITION; ATOMS; ELECTRODEPOSITION; SURFACE ROUGHNESS; TEXTURES;

CU RESISTIVITIES; HIGH ASPECT RATIO; HIGH ASPECT RATIO VIA; HYDROGEN PLASMAS; PATTERNED SUBSTRATES; PLASMA-ENHANCED ATOMIC LAYER DEPOSITION; PRE-TREATMENTS; SEED LAYER;

ASPECT RATIO;

EID: 40849111215     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2779071     Document Type: Conference Paper

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