Questions concerning the migration to lead-free solder

Circuit World

Volumn 30, Issue 2, 2004, Pages 34-40+6+8

  Ciocci, Richard ^a   Pecht, Michael ^b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electronic industry; Lead; Solder

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ENVIRONMENTAL PROTECTION; EUTECTICS; LEAD; RECYCLING; REGULATORY COMPLIANCE; RELIABILITY;

LEAD-FREE SOLDERS; MELTING POINTS;

SOLDERING ALLOYS;

EID: 0842333942     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410512226     Document Type: Review

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