SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 168-175

The interactions of lead (Pb) in lead free solder (Sn/Ag/Cu) system

(4) Key Chung, Chee a Aspandiar, Raiyo b Foo Leong, Kum a Tay, Cheng Siew a

a INTEL CORPORATION (United States)

b NONE (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; LEAD; MICROSTRUCTURE; POLISHING; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING; TERNARY SYSTEMS; THERMAL CYCLING;

LEAD FREE SOLDERING;

PRINTED CIRCUIT BOARDS;

EID: 0036292810 PISSN: 05695503 EISSN: None Source Type: Journal
DOI: 10.1109/ECTC.2002.1008091 Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.