Grain growth in eutectic Pb/Sn ball grid array solder joints

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 903-908

  Basaran, C ^a   Wen, Yujun ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Electronic packaging thermal management; Electronics industry; Electronics packaging; Fatigue; Finite element methods; Soldering; Surface mount technology; Testing; Thermomechanical processes; Tin

Indexed keywords

BALL GRID ARRAYS; CONTINUUM DAMAGE MECHANICS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FATIGUE DAMAGE; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; RELIABILITY; SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TESTING; TIN;

BALL GRID ARRAY SOLDER JOINTS; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING INDUSTRY; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; FATIGUE RELIABILITY; PACKAGING TECHNOLOGIES; THERMO MECHANICAL FATIGUES (TMF); THERMOMECHANICAL PROCESS;

GRAIN GROWTH;

EID: 40549090713     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012551     Document Type: Conference Paper

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