Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn-Pb solder alloys

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1347-1353

  Liu, Changqing ^a   Huang, Zhiheng ^a   Conway, Paul ^a   Thomson, Rachel ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; INTERMETALLICS; LEAD ALLOYS; MATHEMATICAL MODELS; METALLURGY; OPTICAL MICROSCOPY; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMODYNAMICS; TIN ALLOYS;

LEAD FREE SOLDERS; ROOM TEMPERATURE; THERMODYNAMIC MODELING;

SOLDERING ALLOYS;

EID: 10444243367     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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