Transitioning to lead-free assemblies

Printed Circuit Design and Manufacture

Volumn 22, Issue 3, 2005, Pages 17-23

  Handwerker, Carol ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL RESISTANCES; FILLET LIFTING; HAND SOLDERING; SOLDER BALLS; VOID FORMATIONS;

ANNEALING; ARRAYS; ASSEMBLY; COST EFFECTIVENESS; DATA ACQUISITION; LEAD ALLOYS; MICROSTRUCTURE; PHASE DIAGRAMS; PROBLEM SOLVING; SEMICONDUCTOR MATERIALS; SOLDERED JOINTS; SOLDERING; TERNARY SYSTEMS; THREE DIMENSIONAL;

MICROELECTRONICS;

EID: 14944384773     PISSN: 15436527     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (9)

1. B. Richards and K. Nimmo, "Update 2000, An Analysis of the Current Status of Lead-Free Soldering - One Year On," a report to DTI (Department of Trade and Industry), tintechnology.biz/soldertec/ soldertec.aspx?page_id=640. See also: lead-free.org.
2. B. P. Richards, C. L. Levoguer, C. P. Hunt, K. Nimmo, S. Peters and P. Cusack, "An Analysis of the Current Status of Lead-Free Soldering," a report to DTI, tintechnology.biz/soldertec/soldertec.aspx?page_id=639.
3. A. Rae and C.A. Handwerker, "NEMI's Lead-Free Alloy: Still Applicable to Today's Commercially Available Alloys," Circuits Assembly, April 2004.
4. F. Hua, R. Aspandiar, T. Rothman, C. Anderson, G. Clemons and M. Klier, "Solder Joint Reliability of SnAgCu Bga Components Attached with Eutectic Pb-Sn Solder Paste," Journal of SMT, vol. 16, issue 1, 2003.
5. C. Handwerker, J. Bath, E. Benedetto, E. Bradley, R. Gedney, T. Siewert, P. Snugovsky, J. Sohn, "NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures," Proceedings of SMT International, 2003.
6. NCMS Lead-Free Solder Project Final Report, August, 1997, and CDROM, August, 1999. To order: ncms.org/3portfolio/2SIGs/ECM.htm.
7. P. Biocca, "Lead-Free and Lead Contamination," Surface Mount Technology, October 2004.
8. P. Borgesen and D.W. Henderson, "White Paper on Fragility of Pb-free Solder Joints," uic.com/wcms/WCMS2.nsf/index/Resources_47.html.
9. P.T.Vianco, J. A. Rejentand P. F. Hlava, "Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder," Journal of Electronic Materials, vol. 33, no. 9, 2004.