Study of micro-BGA solder joint reliability

Microelectronics Reliability

Volumn 41, Issue 2, 2001, Pages 287-293

  Tu, P L ^a   Chan, Y C ^a   Hung, K C ^a   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; LIFE CYCLE; Q FACTOR MEASUREMENT; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

MICRO-BALL GRID ARRAYS;

MICROELECTRONICS;

EID: 0035120871     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00217-1     Document Type: Article

References (23)

1. Koyama T, Sasaki M, Wakabayashi S. Advanced CSP and substrate technologies. Proceedings of 1996 International Symposium on Microelectronics (SPTE vol. 2920). 1996. p. 265-70.
2. Lau JH, Pao Y-H. Solder joint reliability of BGA, CSP, and fine pitch SMT assemblies. New York: McGraw Hill; 1997. p. 297-328.
3. Mitchell C. Assembly and reliability study for the micro ball grid array. IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings. 1997. p. 344-6.
4. Joseph F. Chip scale packages. Print Circ Desig. 5(2):1998;12-16.
5. Koyama T, Abe K, Sakaguchi N, Wakabayashi S. Reliability of mBGA mounted on a printed circuit board. Proceedings of the 1995 Surface Mount International. 1995. p. 43-56.
6. Partridge J, Boysan P, Foehringer D. Influence of process variables on the reliability of micro BGATM package assemblies. Proceedings of the 48th Electronic Components & Technology Conference, Seattle. May 1998. p. 518-24.
7. Ghaffarian R, Kim NP. Reliability and failure analyses of thermally cycled ball grid array assemblies. Proceedings of the 48th Electronic Components & Technology Conference, Seattle. May 1998. p. 713-20.
8. Lee T, Lee J, Jung I. Finite element analysis for solder ball failure in chip scale package. Proceedings of the 1997 Sixth International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore. July 1997. p. 39-43.
9. Daya Perera U. Evaluation of reliability of micro BGA solder joints through twisting and bending. Proceedings 1996 International Symposium on Microelectronics Minneapolis. (SPIE vol. 2920), 1996. p. 265-70.
10. Juso H, Yamaji Y, Kimura T, Fujita K, Kada M. Board level reliability of CSP. Proceedings of the 48th Electronic Components & Technology Conference, Seattle. May 1998. p. 525-31.
11. Wu YP, Chan YC, Lai JKL. Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient. Proceedings of the 48th Electronic Components & Technology Conference, Seattle. May 1998. p. 292-6.
12. Lee N-C. Optimizing reflow profile via defect mechanisms analysis. Proceedings of the Third International Symposium on Electronic Packaging Technology, Beijing. August 1998. p. 261-70.
13. Evans R, Boulos M, Huynh T, Leonard G, Kane V, Sanches W, Avery M, Sward D, Brown D. Ball grid array (BGA), microBGA (micro-BGA), chip scale package (CSP), and 0.4 mm ultra-fine pitch implementation at USRobotics. Proceedings of the Technical Conference, IP Printed Circuits EXPO. 1997. p. S9/4/1-25.
14. Blair HD, Pan TY, Nicholson JM. Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders. Proceedings of the 48th Electronic Components & Technology Conference, Seattle. 1998. p. 259-67.
15. Chan Y.C., Tu P.L., So A.C., Lai J.K.L. Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints. IEEE Trans CPMT-Part B. 20(4):1997;463-469.
16. Tu PL, Chan YC, Hong KC, Lai JKL. Growth kinetics of intermetallic compounds in chip scale package solder joint. Scripta Materialia in press.
17. Tam AC. Tin and solder plating in the semiconductor industry. London: Chapman and Hall; 1993. p. 207.
18. Cengel YA. Heat transfer - a practical approach. New Jersey: McGraw-Hill; 1997. p. 29-30.
19. Cengel YA. Heat transfer - a practical approach. New Jersey: McGraw-Hill; 1997. p. 226-40.
20. Cengel YA. Heat transfer - a practical approach. New Jersey: McGraw-Hill; 1997. p. 949-50.
21. Tu P.L., Chan Y.C., Lai J.K.L. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints. IEEE Trains Component Packag Manufact Tech-Part B. 20(1):1997;87-93.
22. Huang YE, Hagen D, Dody G, Burnette T. Effect of solder reflow temperature profile on plastic package delamination. 1998 IEEE/CPMT International Electronic Manufacturing Technology Symposium. 1998. p. 105-11.
23. Petzow G. Metallographic etching. Ohio, Metals Park: American Society for Metals; 1978. p. 77.