Microstructural investigation of lead-free BGAs soldered with tin-lead solder

Soldering and Surface Mount Technology

Volumn 17, Issue 2, 2005, Pages 10-21

  Grossmann, Günter ^a   Tharian, Joy ^a   Jud, Pascal ^a   Sennhauser, Urs ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Lead; Metals; Solder; Soldering

Indexed keywords

ELECTRONIC EQUIPMENT; ENERGY DISPERSIVE SPECTROSCOPY; MELTING; METALLIZING; METALS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMOCOUPLES;

FOCUSED ION BEAM MICROSCOPY (FIB); LEAD-FREE PRODUCTION; TIN-SILVER-COPPER SOLDERS; UBM;

SOLDERING;

EID: 21044434900     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510597465     Document Type: Article

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