Failure analysis of lead-free solder joints for high-density packages

Soldering and Surface Mount Technology

Volumn 16, Issue 2, 2004, Pages

  Lau, John ^a   Shangguan, Dongkai ^b   Castello, Todd ^c   Horsley, Rob ^d   Smetana, Joe ^e   Hoo, Nick ^f   Dauksher, Walter ^a   Love, Dave ^g   Menis, Irv ^h   Sullivan, Bob ⁱ  

^a AGILENT TECHNOLOGIES   (United States)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c Flextronics   (United States)

^d Celestica   (United Kingdom)

^e NOKIA RESEARCH CENTER   (United States)

^f Tin Technology   (United Kingdom)

^g SUN MICROSYSTEMS   (United States)

^h IBM   (United States)

ⁱ HDPUG   (United States)

Author keywords

Joining processes; Printed circuit boards; Product reliability; Solders

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); PHASE TRANSITIONS; PRINTED CIRCUIT BOARDS; SHRINKAGE; THERMAL CYCLING;

HIGH-DENSITY PACKAGES; PLASTIC BALL GRID ARRAYS; SOLDER FLUXES; SOLDER JOINTS;

SOLDERING ALLOYS;

EID: 2942574462     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910410537345     Document Type: Article

References (8)

1. Blair, H., Pan, T. and Nicholson, J. (1998), "Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with SnPb, SnAg, and Sn solders", Proceedings of the 48th IEEE Electronic Components and Technology Conference, Seattle, pp. 259-67.
2. Chan, Y., Yu, P., Tang, C., Hung, K. and Lai, J. (2001), "Reliability studies of μBGA solder joints - effects of NiSn intermetallic compound", IEEE Transactions on Advanced Packaging, Vol. 24, pp. 25-31.
3. Deepak, G., Lane, T., Kinzie, P., Panichas, C., Chong, K. and Villalobos, O. (2002), "Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface", Proceedings of the 52nd IEEE Electronic Components and Technology Conference, San Diego, CA, pp. 732-9.
4. Jeon, Y., Paik, K., Bok, K., Choi, W. and Cho, C. (2001), "Studies on NiAu intermetallic compound and P-rich Ni layer at the electroless Ni UBM - solder interface and their effects on flip chip solder joint reliability", Proceedings of the 51st IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 69-75.
5. Lau, J., Dauksher, W., Smetana, J., Horsley, R., Shangguan, D., Castello, T., Menis, I., Love, D. and Sullivan, B. (2004a), "Design for lead-free solder joints reliability of high-density packages", Soldering and Surface Mount Technology, Vol. 16 No. 1, pp. 12-26.
6. Lau, J., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., Love, D., Menis, I. and Sullivan, B. (2004b), "Reliability test and data analysis of high-density packages' lead-free solder joints", Soldering and Surface Mount Technology, Vol. 16 No. 2.
7. Sabine, A., Andreas, O., Hermann, O., Rolf, A. and Herbert, R. (1999), "Reliability of electroless nickel for high temperature application", Proceedings of the International Symposium on Advanced Packaging Materials. Atlanta, GA, pp. 256-61.
8. Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, I., Memis, I., Love, D., Dauksher, W. and Sullivan, B. (2003), "Design materials and process for lead-free assembly of high density packages", Soldering and Surface Mount Technology, Vol. 16 No. 1, pp. 53-62.