Addition of silver in copper nitride films deposited by reactive magnetron sputtering

Scripta Materialia

Volumn 58, Issue 7, 2008, Pages 568-570

  Pierson, J F ^a   Horwat, D ^a  

^a INSTITUT JEAN LAMOUR   (France)

Author keywords

Copper nitride; Reactive sputtering; Structure

Indexed keywords

ADDITION REACTIONS; MAGNETRON SPUTTERING; MOLECULAR STRUCTURE; NICKEL COMPOUNDS; REACTIVE SPUTTERING; X RAY SPECTROSCOPY;

COPPER NITRIDE FILMS;

SILVER;

EID: 38749116204     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.11.016     Document Type: Article

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