Thermal stability of copper nitride films prepared by rf magnetron sputtering

Thin Solid Films

Volumn 325, Issue 1-2, 1998, Pages 55-59

  Liu, Z Q ^a   Wang, W J ^a   Wang, T M ^a   Chao, S ^a   Zheng, S K ^a  

^a LANZHOU UNIVERSITY   (China)

Author keywords

Copper nitride film; Magnetron sputtering deposition; Thermal stability

Indexed keywords

ANNEALING; ARGON; COPPER COMPOUNDS; FILM PREPARATION; MAGNETRON SPUTTERING; NITRIDES; NITRIDING; THERMAL EFFECTS; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

RADIO FREQUENCY MAGNETRON SPUTTERING;

METALLIC FILMS;

EID: 0032115491     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)00448-9     Document Type: Article

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