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Volumn 66, Issue 1, 2002, Pages 59-64
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Structure and properties of copper nitride films formed by reactive magnetron sputtering
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Author keywords
Cu3N; Electrical resistivity; Hardness; Reactive sputtering; Structure
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Indexed keywords
CRYSTAL STRUCTURE;
DEPOSITION;
ELECTRIC CONDUCTIVITY;
GLASS;
LATTICE CONSTANTS;
MAGNETRON SPUTTERING;
MICROHARDNESS;
MORPHOLOGY;
NANOSTRUCTURED MATERIALS;
SCANNING ELECTRON MICROSCOPY;
STEEL;
ULTRAVIOLET SPECTROSCOPY;
X RAY DIFFRACTION;
REACTIVE SPUTTERING;
ULTRAVIOLET-VISIBLE SPECTROMETRY;
COPPER COMPOUNDS;
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EID: 0036607059
PISSN: 0042207X
EISSN: None
Source Type: Journal
DOI: 10.1016/S0042-207X(01)00425-0 Document Type: Article |
Times cited : (123)
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References (20)
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