-
1
-
-
0033301647
-
"Microfabrication in biology and medicine"
-
J. Voldman, M. L. Gray, and M. A. Schmidt, "Microfabrication in biology and medicine," Annu. Rev. Biomed. Eng., vol. 1, pp. 401-425, 1999.
-
(1999)
Annu. Rev. Biomed. Eng.
, vol.1
, pp. 401-425
-
-
Voldman, J.1
Gray, M.L.2
Schmidt, M.A.3
-
2
-
-
0037096666
-
"Micro total analysis systems"
-
D. R. Reyes, D. Iossifidis, P.-A. Auroux, and A. Manz, "Micro total analysis systems," Analytical Chem., vol. 74, pp. 2623-2652, 2002.
-
(2002)
Analytical Chem.
, vol.74
, pp. 2623-2652
-
-
Reyes, D.R.1
Iossifidis, D.2
Auroux, P.-A.3
Manz, A.4
-
3
-
-
0037060168
-
"Polymer microfluidic devices"
-
H. Becker and L. E. Locascio, "Polymer microfluidic devices," Talanta, vol. 56, pp. 267-287, 2002.
-
(2002)
Talanta
, vol.56
, pp. 267-287
-
-
Becker, H.1
Locascio, L.E.2
-
8
-
-
0027084851
-
"Polymer bonding of micro-machined silicon structures"
-
C. D. Besten, R. E. G. van Hal, J. Munoz, and P. Bergveld, "Polymer bonding of micro-machined silicon structures," in Proc. IEEE Microelectromechanical Systems Conf., 1992, pp. 104-109.
-
(1992)
Proc. IEEE Microelectromechanical Systems Conf.
, pp. 104-109
-
-
Besten, C.D.1
van Hal, R.E.G.2
Munoz, J.3
Bergveld, P.4
-
9
-
-
0033076543
-
"Low temperature nafion bonding of silicon wafers"
-
B. Ilic, P. Neuzil, T. Stanczyk, D. Czaplewski, and G. J. Maclay, "Low temperature nafion bonding of silicon wafers," Electrochem. Solid-State Lett., vol. 2, pp. 86-87, 1999.
-
(1999)
Electrochem. Solid-State Lett.
, vol.2
, pp. 86-87
-
-
Ilic, B.1
Neuzil, P.2
Stanczyk, T.3
Czaplewski, D.4
Maclay, G.J.5
-
10
-
-
0033721565
-
"A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems"
-
A. Han, K. W. Oh, S. Bhansali, H. T. Henderson, and C. H. Ahn, "A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems," in Proc. IEEE Microelectromechanical Systems Conf., 2000, pp. 414-418.
-
(2000)
Proc. IEEE Microelectromechanical Systems Conf.
, pp. 414-418
-
-
Han, A.1
Oh, K.W.2
Bhansali, S.3
Henderson, H.T.4
Ahn, C.H.5
-
11
-
-
0035425913
-
"Low-temperature full wafer adhesive bonding of structured wafers"
-
F. Niklaus, H. Andersson, P. Enoksson, and G. Stemme, "Low-temperature full wafer adhesive bonding of structured wafers," Sens. Actuators A, vol. 92, pp. 235-241, 2001.
-
(2001)
Sens. Actuators A
, vol.92
, pp. 235-241
-
-
Niklaus, F.1
Andersson, H.2
Enoksson, P.3
Stemme, G.4
-
12
-
-
0343550309
-
"Polymer microfabrication methods for microfluidic analytical applications"
-
H. Becker and C. Gartner, "Polymer microfabrication methods for microfluidic analytical applications," Electrophoresis, vol. 21, pp. 12-26, 2000.
-
(2000)
Electrophoresis
, vol.21
, pp. 12-26
-
-
Becker, H.1
Gartner, C.2
-
13
-
-
21544455278
-
"UV laser machined polymer substrates for the development of microdiagnostic systems"
-
M. A. Roberts, J. S. Rossier, P. Bercier, and H. Girault, "UV laser machined polymer substrates for the development of microdiagnostic systems," Anal. Chem., vol. 69, pp. 2035-2042, 1997.
-
(1997)
Anal. Chem.
, vol.69
, pp. 2035-2042
-
-
Roberts, M.A.1
Rossier, J.S.2
Bercier, P.3
Girault, H.4
-
14
-
-
0031703290
-
"A self-filling low-cost membrane micropump"
-
K.-P. Kamper, J. Dopper, W. Ehrfeld, and S. Oberbeck, "A self-filling low-cost membrane micropump," in Proc. IEEE Micro Electro Mechanical Systems Conf., 1998, pp. 432-437.
-
(1998)
Proc. IEEE Micro Electro Mechanical Systems Conf.
, pp. 432-437
-
-
Kamper, K.-P.1
Dopper, J.2
Ehrfeld, W.3
Oberbeck, S.4
-
15
-
-
0036122188
-
"Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging"
-
J. B. Kim, M. Chiao, and L. Lin, "Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging," in Proc. IEEE Microelectromechanical Systems Conf., 2002, pp. 415-418.
-
(2002)
Proc. IEEE Microelectromechanical Systems Conf.
, pp. 415-418
-
-
Kim, J.B.1
Chiao, M.2
Lin, L.3
-
16
-
-
0037439006
-
"Silicon wafer bonding through RF dielectric heating"
-
A. Bayrashev and B. Ziaie, "Silicon wafer bonding through RF dielectric heating," Sens. Actuators A, vol. 103, pp. 16-22, 2003.
-
(2003)
Sens. Actuators A
, vol.103
, pp. 16-22
-
-
Bayrashev, A.1
Ziaie, B.2
-
17
-
-
0009471071
-
"Microfabricated biocapsules for the immuno-isolation of pancreatic islets of langerhans"
-
Ph.D. dissertation, Univ. California, Berkeley
-
T. Desai, "Microfabricated biocapsules for the immuno-isolation of pancreatic islets of langerhans," Ph.D. dissertation, Univ. California, Berkeley, 1998.
-
(1998)
-
-
Desai, T.1
-
19
-
-
0003890970
-
"Selective encapsulations of mems: Micro channels, needles, resonators, and electro-mechanical filters"
-
Ph.D. dissertation, Univ. California, Berkeley
-
L. Lin, "Selective encapsulations of mems: micro channels, needles, resonators, and electro-mechanical filters," Ph.D. dissertation, Univ. California, Berkeley, 1993.
-
(1993)
-
-
Lin, L.1
-
20
-
-
0034317743
-
"MEMS post-packaging by localized heating and bonding"
-
Nov.
-
L. Lin, "MEMS post-packaging by localized heating and bonding," IEEE Trans. Adv. Packag., vol. 23, no. 4, pp. 608-616, Nov. 2000.
-
(2000)
IEEE Trans. Adv. Packag.
, vol.23
, Issue.4
, pp. 608-616
-
-
Lin, L.1
-
21
-
-
0033904174
-
"Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging"
-
Mar.
-
Y.-T. Cheng, L. Lin, and K. Najafi, "Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging," IEEE/ASME J. Microelectromechanical Systems, vol. 9, no. 1, pp. 3-8, Mar. 2000.
-
(2000)
IEEE/ASME J. Microelectromechanical Systems
, vol.9
, Issue.1
, pp. 3-8
-
-
Cheng, Y.-T.1
Lin, L.2
Najafi, K.3
-
23
-
-
0003397084
-
-
New York: McGraw-Hill
-
J. P. Holman, Heat Transfer. New York: McGraw-Hill, 2002.
-
(2002)
Heat Transfer
-
-
Holman, P.1
-
25
-
-
0036772724
-
"Vacuum packaging technology using localized aluminum/ silicon-to-glass bonding"
-
Oct.
-
Y.-T. Cheng, W.-T. Hsu, K. Najafi, C. T.-C. Nguyen, and L. Lin, "Vacuum packaging technology using localized aluminum/ silicon-to-glass bonding," IEEE/ASME J. Microelectrmechanical Systems, vol. 11, no. 5, pp. 556-565, Oct. 2002.
-
(2002)
IEEE/ASME J. Microelectrmechanical Systems
, vol.11
, Issue.5
, pp. 556-565
-
-
Cheng, Y.-T.1
Hsu, W.-T.2
Najafi, K.3
Nguyen, C.T.-C.4
Lin, L.5
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