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Volumn 28, Issue 4, 2005, Pages 635-642

Localized bonding processes for assembly and packaging of polymeric MEMS

Author keywords

Assembly; Bonding; Encapsulation; Localized heating; Microelectromechanical systems (MEMS); Packaging; Polymer

Indexed keywords

ADHESIVES; ASSEMBLY; ELECTRONICS PACKAGING; ENCAPSULATION; GLASS BONDING; LOW TEMPERATURE EFFECTS; PRESSURE EFFECTS; SEALING (FINISHING); SEMICONDUCTING POLYMERS;

EID: 28444495133     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.858333     Document Type: Article
Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.