Insights into correlation between board-level drop reliability and package-level ball impact test characteristics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 1, 2007, Pages 84-91

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Ball impact test (BIT); Board level drop test; Correlation; Finite element methods; Reliability

Indexed keywords

FINITE ELEMENT METHOD; IMPACT TESTING; INTERMETALLICS; PRINTED CIRCUIT BOARDS; RELIABILITY ANALYSIS; STRESS CONCENTRATION;

BALL IMPACT TEST; BOARD-LEVEL DROP TEST; DROP RELIABILITY INDEX;

SOLDERED JOINTS;

EID: 34047101336     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.890640     Document Type: Article

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