Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 103-108

  Kariya, Yoshiharu ^a   Hosoi, Takuya ^a   Kimura, Takashi ^a   Terashima, Shinichi ^b   Tanaka, Masamoto ^b   Suga, Tadatomo ^c  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b NIPPON STEEL CORPORATION   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

BGA joints; Fatigue life; Flip chip; Lead free solder; Low silver content; Ni addition; Shear Fatigue; Sn Ag Cu

Indexed keywords

BGA JOINTS; FLIP-CHIP; LEAD-FREE SOLDER; LOW SILVER CONTENTS; NI ADDITION; SHEAR FATIGUE; SN-AG-CU;

BRITTLENESS; DUCTILITY; ENVIRONMENTAL IMPACT; FATIGUE OF MATERIALS; INTERMETALLICS; KINEMATICS; MICROSTRUCTURE; NICKEL; SILVER ALLOYS; SOLDERING ALLOYS;

FLIP CHIP DEVICES;

EID: 4444344332     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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