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Volumn 16, Issue 9, 2007, Pages 2803-2808

High density Al2O3/TaN-based metal-insulator-metal capacitors in application to radio frequency integrated circuits

Author keywords

Al2O3; Atomic layer deposition; Metal insulator metal; Radio frequency integrated circuit

Indexed keywords

ALUMINUM COMPOUNDS; ATOMIC LAYER DEPOSITION; INTEGRATED CIRCUITS; LEAKAGE CURRENTS; MIM DEVICES; NATURAL FREQUENCIES;

EID: 36349024218     PISSN: 10091963     EISSN: 17414199     Source Type: Journal    
DOI: 10.1088/1009-1963/16/9/051     Document Type: Article
Times cited : (12)

References (21)
  • 3
    • 48049115855 scopus 로고    scopus 로고
    • Radio frequency and analog/mixed-signal technologies for wireless communications
    • Radio Frequency and Analog/Mixed-Signal Technologies for Wireless Communications 2005 International Technology Roadmap for Semiconductors (Semiconductor Industry Association, Palo Alto)
    • (2005) International Technology Roadmap for Semiconductors


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.