A replication process of metallic micro-mold by using parylene embossing and electroplating

Microelectronic Engineering

Volumn 85, Issue 1, 2008, Pages 161-167

  Youn, Sung Won ^a   Goto, Hiroshi ^a   Takahashi, Masaharu ^a   Oyama, Shoji ^b   Oshinomi, Yasuhiko ^b   Matsutani, Kinya ^b   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Engineering Department   (Japan)

Author keywords

Hot embossing; Lithography; Metallic micro mold; Parylene C (poly chloro p xylylene C)

Indexed keywords

ELECTROPLATING; ETCHING; LITHOGRAPHY; NICKEL; SILICON;

HOT-EMBOSSING; METALLIC MICRO-MOLDS;

ORGANIC POLYMERS;

EID: 36249018428     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.005     Document Type: Article

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