Fatigue and thermal fatigue damage analysis of thin metal films

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 2007-2013

  Zhang, G P ^a   Volkert, C A ^b   Schwaiger, R ^b   Monig R ^b   Kraft, O ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DAMAGE DETECTION; EXTRUSION; FILM THICKNESS; METALS; MICROMETERS; RELIABILITY THEORY; THERMAL FATIGUE;

BULK MATERIALS; DAMAGE BEHAVIOR; FATIGUE PROPERTIES; THIN METAL FILMS;

THIN FILMS;

EID: 35548953054     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.04.005     Document Type: Article

References (32)

1. Nix W.D. Mechanical properties of thin films. Metall Trans A 20 (1989) 2217-2245
2. Arzt E. Size effects in materials due to microstructural and dimensional constraints: a comparative review. Acta Mater 46 (1998) 5611-5626
3. Hofbeck R., Hausmann K., Ilschner B., and Künzi H.U. Fatigue of very thin copper and gold wires. Scripta Metall 20 (1986) 1601-1605
4. Judelewicz M., Künzi H.U., Merk N., and Ilschner B. Microstructural development during fatigue of copper foils 20-100 μm thick. Mater Sci Eng A 186 (1994) 1-142
5. Hong S., and Weil R. Low cycle fatigue of thin copper foils. Thin Solid Films 283 (1996) 175-181
6. Read T.D. Tension-tension fatigue of Cu thin films. Int J Fatigue 20 (1998) 203-209
7. Schwaiger R., and Kraft O. High cycle fatigue of thin silver films investigated by dynamic microbeam deflection. Scripta Mater 41 (1999) 823-829
8. Kraft O., Schwaiger R., and Wellner P. Fatigue in thin films: lifetime and damage formation. Mater Sci Eng A 319-321 (2001) 919-923
9. Kraft O., Wellner P., Hommel M., Schwaiger R., and Arzt E. Fatigue behavior of polycrystalline thin copper films. Z Metallkd 93 (2002) 392-400
10. Schwaiger R., Dehm G., and Kraft O. Cyclic deformation of polycrystalline Cu films. Philos Mag 83 (2003) 693-710
11. Schwaiger R., and Kraft O. Size effects in the fatigue behavior of thin Ag films. Acta Mater 51 (2003) 195-206
12. Zhang G.P., Schwaiger R., Volkert C.A., and Kraft O. Effect of film thickness and grain size on fatigue-induced dislocations structures in Cu films. Phil Mag Lett 83 (2003) 477-483
13. Mönig R., Keller R.R., and Volkert C.A. Thermal fatigue testing of thin metal films. Rev Sci Instrum 75 (2004) 4997-5004
14. Zhang G.P., Volkert C.A., Schwaiger R., Arzt E., and Kraft O. Damage behavior of 200-nm thin copper films under cyclic loading. J Mater Res 20 (2005) 201-207
15. Takashima K., Higo Y., Sugiura S., and Shimojo M. Fatigue crack growth behavior of micro-sized specimens. Mater Trans 42 (2001) 68-73
16. Zhang G.P., Takashima K., Shimojo M., and Higo Y. Fatigue behavior of microsized austenitic stainless steel specimens. Mater Lett 57 (2003) 1555-1560
17. Schwaiger R. Fatigue behavior of sub-micron silver and copper films. Ph.D. thesis. Stuttgart: University of Stuttgart; 2001, p. 39.
18. Hommel M., Kraft O., and Arzt E. A new method to study cyclic deformation of thin films in tension and compression. J Mater Res 14 6 (1999) 2373-2376
19. Zhang G.P., Volkert C.A., Schwaiger R., Wellner P., Arzt E., and Kraft O. Length-scale-controlled fatigue mechanisms in thin copper films. Acta Mater 54 (2006) 3127-3139
20. Zhang G.P., Takashima K., and Higo Y. Fatigue strength of small-scale Type 304 stainless steel thin films. Mater Sci Eng A 426 (2006) 95-100
21. Cho H.S., Hemker K.J., Lian K., Goettert J., and Dirras G. Measured mechanical properties of LIGA Ni structures. Sensor Actuat A-Phys 103 (2003) 59-63
22. Allameh S.M., Lou J., Kavishe F., Buchheit T.E., and Soboyejo W.O. An investigation of fatigue in LIGA Ni MEMS thin films. Mater Sci Eng A 371 (2004) 256-266
23. Boyce B., Michael J.R., and Kotula P.G. Fatigue of metallic microdevices and the role of fatigue-induced surface oxides. Acta Mater 52 (2004) 1609-1619
24. Aktaa J., Reszat J.Th., Walter M., Bade K., and Hemker K.J. High cycle fatigue and fracture behavior of LIGA Nickel. Scripta Mater 52 (2005) 1217-1221
25. Yang Y., Imasogie B.I., Allameh S.M., Boyce B., Lian K., Lou J., et al. Mechanisms of fatigue in LIGA Ni MEMS thin films. Mater Sci Eng A 444 (2007) 39-50
26. Mönig R. Thermal fatigue of Cu thin films, Ph.D. thesis. Stuttgart: University of Stuttgart; 2004. .
27. Mönig R., Park Y.B., and Volkert C.A. Thermal fatigue in copper interconnects. Stress-induced phenomena in metallization. AIP Conf Proc (2006), American Institute of Physics, Melville, NY 136-156
28. Park Y.B., Mönig R., and Volkert C.A. Thermal fatigue as a possible failure mechanism in copper interconnects. Thin Solid Films 504 (2006) 321-324
29. Zhang GP, Mönig R, Park YB, Volkert CA. Thermal fatigue failure analysis of copper interconnects under alternating currents. In: Proceedings of 2005 6th international conference on electronic packaging technology, IEEE. p. 653-6.
30. Balk T.J., Dehm G., and Arzt E. Parallel glide: unexpected dislocation motion parallel to the substrate in ultrathin copper films. Acta Mater 51 (2003) 4471-4485
31. Keller R.R., Geiss R.H., Cheng Y., and Read D.T. Microstructural evolution during electric current induced thermomechanical fatigue of interconnects. Mater Res Soc Symp Proc 863 (2005) B9.5.1-B9.5.6
32. Geiss R.H., Keller R.R., Read D.T., and Cheng Y. TEM-based analysis of defects induced by AC thermomechanical versus microtensile deformation in aluminum thin films. Mater Res Soc Symp Proc 863 (2005) O11.2.1-O11.2.6