Fatigue behavior of microsized austenitic stainless steel specimens

Materials Letters

Volumn 57, Issue 9-10, 2003, Pages 1555-1560

  Zhang, G P ^a,b   Takashima, K ^a   Shimojo, M ^a   Higo, Y ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Austenitic stainless steel; Fatigue; Fine grain; Microsized material

Indexed keywords

AUSTENITE; BENDING (DEFORMATION); CRACK INITIATION; CRACK PROPAGATION; DYNAMIC MECHANICAL ANALYSIS; FATIGUE TESTING; GRAIN SIZE AND SHAPE; MICROELECTROMECHANICAL DEVICES; STRAIN HARDENING;

MICROSIZED COMPONENTS;

STAINLESS STEEL;

EID: 0037309928     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(02)01023-6     Document Type: Article

References (10)

1. Spearing S.M. Acta Mater. 48:2000;179.
2. Takashima K., Higo Y., Sugiura S., Shimojo M. Mater. Trans. 42:2001;68.
3. Kraft O., Schwaiger R., Wellner P. Mater. Sci. Eng., A. 319-321:2001;919.
4. Schwaiger R., Kraft O. Scr. Mater. 41:1999;823.
5. Ichikawa Y., Maekawa S., Takashima K., Shimojo M., Higo Y., Swain M.V. deBoer M.P., Heuer A.H., Jacobs S.J., Peeters E. Materials Science of Microelectromechanical Systems (MEMS) Devices II. Materials Research Society Symposium Proceedings. vol. 605:1999;273.
6. Zhang G.P., Takashima K., Shimojo M., Higo Y. deBoer M., Judy M., Kahn H., Spearing S.M. Materials Science of Microelectromechanical Systems (MEMS) Devices III. Materials Research Society Proceedings. vol. 657:2000;EE5.10.
7. Takashima K., Maekawa S., Shimojo M., Higo Y., Sugiura S., Pfister B., Swain M.V. Wu X.R., Wang Z.G. Proceedings of the 7th International Fatigue Congress. 1999;1871 High Education Press, Cradley Heath, UK.
8. Saka H. J. Vac. Sci. Technol., B. 16:1998;2522.
9. Hennessy D., Steckel G., Altstetter C. Metall. Trans. 7A:1976;415.
10. Ma B.T., Laird C. Acta Metall. 37:1989;325.