Microstructure evolution during electric current induced thermomechanical fatigue of interconnects

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 295-300

  Keller, Robert R ^a   Geiss, Roy H ^a   Cheng, Yi Wen ^a   Read, David T ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; DEFORMATION; ELECTRIC CURRENTS; FATIGUE OF MATERIALS; SCANNING ELECTRON MICROSCOPY; THERMOMECHANICAL TREATMENT;

COPPER INTERCONNECTS; ELECTRON BACKSCATTER DIFFRACTION; LOCALIZED PLASTICITY;

MICROSTRUCTURE;

EID: 28844481121     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b9.5     Document Type: Conference Paper

References (8)

1. F. R. Brotzen, Int. Mater. Rev. 39, 24 (1994).
2. W. D. Nix, Mater. Sci. Eng. A234, 37 (1997).
3. nd ed. (Dover Publications, New York, 1987) pp. 618-641.
4. M. Huang, Z. Suo, and Q. Ma, J. Mech. Phys. Sol. 50, 1079 (2002).
5. R. R. Keller, R. Mönig, C. A. Volkert, E. Arzt, R. Schwaiger, and O. Kraft, in 6th International Workshop on Stress-Induced Phenomena in Metallization, edited by S. P. Baker, M. A. Korhonen, E. Arzt, and P. Ho, (AIP Conference Proceedings 612, American Institute of Physics, New York,2002) pp. 119-132.
6. R. Mönig, R. R. Keller, and C. A. Volkert, Rev. Sci. Instrum. 75, 4997 (2004).
7. R.H. Geiss, R.R. Keller, D.T. Read and Y.-W. Cheng, this proceedings (2005).
8. Li, Li, Zhang, Wang, and Lu, Phil. Mag. A82, 3129 (2002).