Thermal fatigue failure analysis of copper interconnects under alternating currents

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Zhang, G P ^a,b   Moenig, R ^b   Park, Y B ^c   Volkert, C A ^d  

^a INSTITUTE OF METAL RESEARCH   (China)

^b MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^c Andong National University   (South Korea)

^d KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CURRENTS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; THERMAL LOAD; THERMOANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

CYCLIC TEMPERATURE; MICROFABRICATION STEPS;

OPTICAL INTERCONNECTS;

EID: 33846295152     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564621     Document Type: Conference Paper

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