Metallization by plating for high-performance multichip modules

IBM Journal of Research and Development

Volumn 42, Issue 5, 1998, Pages 587-596

  Wong, K K H ^a,b,c,d,e,f   Kaja, S ^a,d,g   DeHaven, P W ^a,d,h  

^a IBM MICROELECTRONICS   (United States)

^b UNIVERSITY AT BUFFALO   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

^d IBM   (United States)

^e ELECTROCHEMICAL SOCIETY   (United States)

^f Education Department   (United States)

^g PENNSYLVANIA STATE UNIVERSITY   (United States)

^h IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; DIELECTRIC MATERIALS; ELECTRIC WIRING; METALLIZING; MULTICHIP MODULES; POLYIMIDES; THIN FILM DEVICES;

INTERCONNECT WIRING;

ELECTROPLATING;

EID: 0032167047     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.425.0587     Document Type: Article

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