Applications of electrochemical microfabrication: An introduction

IBM Journal of Research and Development

Volumn 42, Issue 5, 1998, Pages 563-566

  Datta, M ^{a,b,c,d,e,f,g,h,i}  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

^c HARCOURT BUTLER TECHNOLOGICAL INSTITUTE   (India)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e EPFL   (Switzerland)

^f IBM   (United States)

^g Intl Society of Electrochemistry   (United States)

^h ELECTROCHEMICAL SOCIETY   (United States)

ⁱ Technology Implementation Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001201448     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.425.0563     Document Type: Article

References (21)

1. L. T. Romankiw, I. Croll, and M. Hatzakis. IEEE Trans. Magn. 6, 729 (1970); L. T. Romankiw. U.S. Patent 3,853,715, December 10, 1974.
2. IBM J. Res. Develop. 41, No. 1/2 (January/March 1997).
3. IBM J. Res. Develop. 37, No. 2 (March 1993).
4. R. R. Tummala and E. J. Rymaszewski, Eds., Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989.
5. The Wall Street Journal, September 22, 1997.
6. IBM Research magazine, No. 4, 16-21 (1997).
7. P. A. Totta and R. P. Sopher, IBM J. Res. Develop. 13, No. 3, 226 (1969).
8. M. Datta, R. V. Shenoy, C. Jahnes, P. C. Andricacos, J. Horkans, J. O. Dukovic, L. T. Romankiw, J. Roeder, H. Deligianni, H. Nye, B. Agarwalla, H. M. Tong, and P. A. Totta, J. Electrochem. Soc. 142, 3779 (1995).
9. J. H. Lau, Flip Chip Technologies, McGraw-Hill Book Co., Inc., New York, 1996.
10. M. L. Minges, Ed., Electronic Materials Handbook, Vol. 1, Packaging, ASM International, Materials Park, OH, 1989.
11. L. T. Romankiw, Electrochim. Acta 42, 2985 (1997).
12. E. K. Yung, L. T. Romankiw, and R. C. Alkire, J. Electrochem. Soc. 136, 206 (1989).
13. A. H. Sweet, N. J. Nelson, and J. F. Battey, Print. Circ. Fabr. 10, 20 (1987).
14. E. E. Castellini, J. V. Powers, and L. T. Romankiw, U.S. Patent 4,102,756, July 25, 1978.
15. P. C. Andricacos and L. T. Romankiw, in Advances in Electrochemical Science and Engineering, Vol. 3, H. Gerischer and C. W. Tobias, Eds.. VCH Publishers, Inc., New York, 1994, p. 230.
16. T. Osaka, Electrochim. Acta 42, 3015 (1997).
17. R. L. Smith, D. J. Fulmer, and S. D. Collins, in Electrochemical Microfabrication, M. Datta, K. Sheppard, and D. Snyder, Eds., PV 92-3, The Electrochemical Society, Pennington, NJ, 1992, p. 203.
18. N. F. de Rooij, in Micromachining and Microfabrication Process Technology III, S.-C. Chang and S. W. Pang, Eds., Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, 1997, pp. 2-9.
19. P. J. McWhorter, A. B. Frazier, and P. Rai-Choudhury, in Handbook of Microlithography, Micromachining and Microfabrication, Vol. 2, P. Rai-Choudhury, Ed., Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, 1997, pp. 3-40.
20. W. Bacher, K. Bade, K. Leyendecker, W. Menz, W. Stark, and A. Thommes, in Electrochemical Technology, N. Masuko, T. Osaka, and Y. Ito, Eds., Kodansha Ltd., Tokyo, 1996, p. 159.
21. E. Chassaing, P. Nallet, M. Walls, and M. J. Hytch, in Magnetic Materials, Processes and Devices IV, L. T. Romankiw and D. Herman, Eds., PV 95-18, The Electrochemical Society, Pennington, NJ, 1996, p. 125.