Moisture ingression effect on stress distributions in NCF-bonded COG packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 467-474

  Tsai, M Y ^a   Wu, C Y ^a   Huang, C Y ^a   Yang, S S ^b  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b OES/ITRI   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADHESIVES; DEFORMATION; ELASTIC MODULI; MOISTURE; STRAIN; STRESS CONCENTRATION;

BI-MATERIAL SPECIMENS; INGRESSION EFFECT; MOISTURE INGRESSION;

ELECTRONICS PACKAGING;

EID: 35348871913     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373839     Document Type: Conference Paper

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