Electroless CoWP as a diffusion barrier between electroless copper and silicon

Journal of Electronic Materials

Volumn 36, Issue 11, 2007, Pages 1408-1414

  Tsai, T K ^a   Wu, S S ^a   Liu, W L ^a   Hsieh, S H ^a   Chen, W J ^b  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Diffusion barrier; Electroless CoWP; Electroless Cu; Silicon

Indexed keywords

ELECTROLESS COWP; FAILURE TEMPERATURE; INTERDIFFUSION;

COPPER; DEPOSITION; DIFFUSION BARRIERS; ELECTROLESS PLATING; RAPID THERMAL ANNEALING; SILICON; THIN FILMS;

COBALT COMPOUNDS;

EID: 35248889918     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0223-4     Document Type: Conference Paper

References (25)

1. C.W. Park, R.W. Vook, Appl. Phys. Lett. 59, 175 (1991)
2. P.J. Pan, C.H. Ting, IEEE Trans. Ind. Electron. IE-29, 154 (1982)
3. L. Vanasupa, Y.C. Joo, P.R. Besser, S. Pramanick, J. Appl. Phys. 85, 2583 (1999)
4. G. Oksam, P.M. Vereecken, P.C. Searson, J. Electrochem. Soc. 146, 1436 (1999)
5. V.M. Dubin, Y. Shacham-Diamand, B. Zhao, P.K. Vasudev, C.H. Ting, J. Electrochem. Soc. 144, 898 (1997)
6. Y. Shacham-Diamand, Electrochem. Solid-State Lett. 3, 279 (2000)
7. R. Junginger, G. Elsner, J. Eelectrochem. Soc. 135, 2304 (1988)
8. H. Homma, T. Kobayashi, J. Electrochem. Soc. 141, 730 (1994)
9. S.W. Hong, Y.S. Lee, J.W. Park, Electrochem. Solid-State Lett. 6, C12 (2003)
10. Y. Shacham-Diamand, V. Dubin, M. Angyal, Thin Solid Films 263, 93 (1995)
11. Y. Shacham-Diamand, S. Lopatin, Electrochim. Acta 44, 3639 (1999)
12. Y. Shacham-Diamand, J. Electron. Mater. 30, 4 (2001)
13. C.Y. Lee, T.H. Huang, S.C. Lu, J. Mater. Sci.: Mater. Electron. 9, 337 (1998)
14. T. Osaka, N. Takano, T. Kurokana, T. Kaneko, K. Ueno, Surf. Coat. Technol. 169-170, 124 (2003)
15. E.J. O'Sullivan, A.G. Schrott, M. Paunovic, C.J. Sambucetti, J.R. Marino, P.J. Bailey, S. Kaja, K.W. Semkow, IBM J. Res. Dev. 42, 607 (1998)
16. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, B. Israel, Y. Sverdlov, Microelectron. Eng. 55, 297 (2001)
17. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, Y. Sverdlov, Mater. Sci. Eng. A 302, 18 (2001)
18. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, Appl. Surf. Sci. 212-213, 367 (2003)
19. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, J. Appl. Phys. 94, 3810 (2003)
20. Y. Shacham-Diamand, A. Zylberman, N. Petrov, Y. Sverdlov, Microelectron. Eng. 64, 315 (2002)
21. B. Lee, Semiconductor Int. July, 95 (2004)
22. C.K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Stamper, A. Domenicucci, X. Chen, Microelecton. Eng. 70, 406 (2003)
23. C.K. Hu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Stamper, A. Domenicucci, X. Chen, Appl. Phys. Lett. 81, 1782 (2002)
24. H.C. Kim, T.L. Alford, Thin Solid Films 449, 6 (2004)
25. J.S. Chen, J.L. Wang, J. Electrochem. Soc. 147, 194 (2000)