Investigation on diffusion barrier properties of reactive sputter deposited TiAlxNyOz thin films for Cu metallization

Thin Solid Films

Volumn 449, Issue 1-2, 2004, Pages 6-11

  Kim, H C ^a   Alford, T L ^a  

^a Arizona State University   (United States)

Author keywords

Cu metallization; Diffusion barrier; Reactive sputtering; TiAlNO thin films

Indexed keywords

ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTRON BEAMS; EVAPORATION; FILM GROWTH; HIGH TEMPERATURE EFFECTS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SPUTTER DEPOSITION; SUBSTRATES; THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

COPPER METALLIZATION; DIFFUSION BARRIERS; REACTIVE SPUTTERING;

THIN FILMS;

EID: 1242265529     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01384-1     Document Type: Article

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