The effect of NH3 plasma treatment on the electrodes copper deposition on TaNx (x = 0 = 1) diffusion barriers

Electrochemical and Solid-State Letters

Volumn 6, Issue 1, 2003, Pages

  Hong, Seok Woo ^a   Lee, Yong Sun ^a   Park, Jong Wan ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; AUGER ELECTRON SPECTROSCOPY; ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; FIELD EMISSION MICROSCOPES; MAGNETRON SPUTTERING; MORPHOLOGY; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; TANTALUM COMPOUNDS; THICKNESS MEASUREMENT;

CRYSTALLINITY; DIFFUSION BARRIER; ELECTROLESS COPPER DEPOSITION; PLASMA TREATMENT;

COPPER;

EID: 0037238951     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1525492     Document Type: Article

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