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Volumn 6, Issue 1, 2003, Pages

The effect of NH3 plasma treatment on the electrodes copper deposition on TaNx (x = 0 = 1) diffusion barriers

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; AUGER ELECTRON SPECTROSCOPY; ELECTRIC CONDUCTIVITY; ELECTRODEPOSITION; FIELD EMISSION MICROSCOPES; MAGNETRON SPUTTERING; MORPHOLOGY; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; TANTALUM COMPOUNDS; THICKNESS MEASUREMENT;

EID: 0037238951     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1525492     Document Type: Article
Times cited : (5)

References (18)
  • 7
    • 0003835724 scopus 로고
    • G. O. Mallory and J. B. Hajdu, Editors; American Electroplaters and Surface Finishers Society, Orlando, FL
    • G. O. Mallory, in Electroless Plating: Fundamentals and Application, G. O. Mallory and J. B. Hajdu, Editors, p. 2 American Electroplaters and Surface Finishers Society, Orlando, FL (1990).
    • (1990) Electroless Plating: Fundamentals and Application , pp. 2
    • Mallory, G.O.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.