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Volumn 6518, Issue PART 2, 2007, Pages

Advances in process overlay-alignment solutions for future technology nodes

Author keywords

[No Author keywords available]

Indexed keywords

CUSTOMER SATISFACTION; IMAGE SEGMENTATION; POLARIZATION; SEMICONDUCTOR MATERIALS; WAVELENGTH;

EID: 35148845088     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.712149     Document Type: Conference Paper
Times cited : (12)

References (16)
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  • 2
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    • Wittekoek, S.1
  • 3
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    • Advances in process overlay
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    • Hinnen, P.1
  • 4
    • 0034768174 scopus 로고    scopus 로고
    • Extended ATHENA alignment performance and application for the 100nm technology node
    • R. Navarro, et al, "Extended ATHENA alignment performance and application for the 100nm technology node", Proc. SPIE Microlithography, vol. 4344, 2001, pp. 682-694
    • (2001) Proc. SPIE Microlithography , vol.4344 , pp. 682-694
    • Navarro, R.1
  • 5
    • 0036030186 scopus 로고    scopus 로고
    • Advances in process overlay: ATHENA alignment system performance on critical process layers
    • D. Laidler, et al, "Advances in process overlay: ATHENA alignment system performance on critical process layers", Proc. SPIE Microlithography, vol. 4689, 2002, pp. 397-408
    • (2002) Proc. SPIE Microlithography , vol.4689 , pp. 397-408
    • Laidler, D.1
  • 6
    • 0141723568 scopus 로고    scopus 로고
    • Overlay Performance with advanced ATHENA alignment recipes
    • J. Huijbrechtse, et al, "Overlay Performance with advanced ATHENA alignment recipes", Proc. SPIE Microlithography, vol. 5038, 2003, pp. 918-928
    • (2003) Proc. SPIE Microlithography , vol.5038 , pp. 918-928
    • Huijbrechtse, J.1
  • 7
    • 0036412866 scopus 로고    scopus 로고
    • Integration of new alignment mark designs in dual inlaid copper interconnect processes
    • S. Warrick, et al, "Integration of new alignment mark designs in dual inlaid copper interconnect processes", Proc. SPIE Microlithography, vol. 4691, 2002, pp. 971-980
    • (2002) Proc. SPIE Microlithography , vol.4691 , pp. 971-980
    • Warrick, S.1
  • 8
    • 25144503816 scopus 로고    scopus 로고
    • Alignment robustness for 90 nm and 65 nm node through copper alignment mark integration optimization
    • S. Warrick, et al, "Alignment robustness for 90 nm and 65 nm node through copper alignment mark integration optimization", Proc. SPIE Microlithography, vol. 5754, 2005, pp. 854-864
    • (2005) Proc. SPIE Microlithography , vol.5754 , pp. 854-864
    • Warrick, S.1
  • 9
    • 33745599576 scopus 로고    scopus 로고
    • Improvement of alignment and overlay accuracy on amorphous carbon layers
    • Y.S. Hwang, et al, "Improvement of alignment and overlay accuracy on amorphous carbon layers", Proc. SPIE Microlithography vol. 6152-73, 2006
    • (2006) Proc. SPIE Microlithography , vol.6152 -73
    • Hwang, Y.S.1
  • 10
    • 4344678638 scopus 로고    scopus 로고
    • Segmented alignment mark optimization and signal strength enhancement
    • Y. Cui, et al, "Segmented alignment mark optimization and signal strength enhancement", Proc. SPIE Microlithography, vol. 5375, 2004, pp. 1265-1277
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    • Cui, Y.1
  • 11
    • 24644512813 scopus 로고    scopus 로고
    • Identifying sources of overlay error in FinFET technology
    • D. Laidler, "Identifying sources of overlay error in FinFET technology", Proc. SPIE Microlithography vol. 5752, p. 80-90
    • Proc. SPIE Microlithography , vol.5752 , pp. 80-90
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  • 12
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    • Non-linear methods for overlay control
    • M. Kupers, et al, "Non-linear methods for overlay control", Proc. SPIE Microlithography vol. 6518-184, 2007
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  • 13
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    • Flexible alignment mark design applications using a next generation phase grating alignment system
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  • 14
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  • 15
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    • P. Hinnen, et al, "Integration of a new alignment sensor for advanced technology nodes", Proc. SPIE Microlithography vol. 6520-74, 2007
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  • 16
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.