-
1
-
-
24644524892
-
Integration of a new alignment mark design in dual inlaid copper processes
-
Paul Hinnen et al, "Integration of a new alignment mark design in dual inlaid copper processes", ARCH Interface 2003
-
ARCH Interface 2003
-
-
Hinnen, P.1
-
3
-
-
0035758765
-
Evaluating device design rules based on lithographic capability
-
S. Warrick et al, "Evaluating Device Design Rules Based on Lithographic Capability", Proc. SPIE Microlithography, vol. 4346, 2001, pp. 917-924
-
(2001)
Proc. SPIE Microlithography
, vol.4346
, pp. 917-924
-
-
Warrick, S.1
-
4
-
-
0036412866
-
Integration of new alignment mark designs in dual inlaid copper interconnect processes
-
S. Warrick, et al, "Integration of new alignment mark designs in dual inlaid copper interconnect processes", Proc. SPIE Microlithography, vol. 4691, 2002, pp. 971-980
-
(2002)
Proc. SPIE Microlithography
, vol.4691
, pp. 971-980
-
-
Warrick, S.1
-
5
-
-
0034768174
-
Extended Athena alignment performance and application for the 100nm technology node
-
R. Navarro, et al, "Extended Athena alignment performance and application for the 100nm technology node", Proc. SPIE Microlithography, vol. 4344, 2001, pp. 682-694
-
(2001)
Proc. SPIE Microlithography
, vol.4344
, pp. 682-694
-
-
Navarro, R.1
-
6
-
-
0036030186
-
Advances in process overlay: ATHENA alignment system performance on critical process layers
-
D. Laidler, et al, "Advances in process overlay: ATHENA alignment system performance on critical process layers", Proc. SPIE Microlithography, vol. 4689, 2002, pp. 397-408
-
(2002)
Proc. SPIE Microlithography
, vol.4689
, pp. 397-408
-
-
Laidler, D.1
-
7
-
-
0141723568
-
Overlay performance with advanced ATHENA alignment recipes
-
J. Huijbrechtse, et al, "Overlay Performance with Advanced ATHENA Alignment Recipes", Proc. SPIE Microlithography, vol. 5038, 2003, pp. 918-928
-
(2003)
Proc. SPIE Microlithography
, vol.5038
, pp. 918-928
-
-
Huijbrechtse, J.1
-
8
-
-
21644448705
-
Demonstration of an extendable and industrial 300mm BEOL integration for 65nm technology node
-
O. Hinsinger, et al, "Demonstration of an extendable and industrial 300mm BEOL integration for 65nm technology node", IEDM Technical Digest, 2004, pp. 317-320
-
(2004)
IEDM Technical Digest
, pp. 317-320
-
-
Hinsinger, O.1
-
9
-
-
24644464706
-
Advances in phase-grating-based wafer alignment systems
-
to be published
-
S. Keij et al, "Advances in Phase-Grating-Based Wafer Alignment Systems", to be published Proc. SPIE Microlithography 2005
-
(2005)
Proc. SPIE Microlithography
-
-
Keij, S.1
-
10
-
-
4344678638
-
Segmented alignment mark optimization and signal strength enhancement for deep trench process
-
Y. Cui et al, "Segmented Alignment Mark Optimization and Signal Strength Enhancement for Deep Trench Process", Proc. SPIE Microlithography, vol. 5375, 2004, pp. 1265-1277
-
(2004)
Proc. SPIE Microlithography
, vol.5375
, pp. 1265-1277
-
-
Cui, Y.1
-
11
-
-
4344570582
-
Alignment mark signal simulation system for the optimum mark feature selection
-
T. Sato et al, "Alignment mark signal simulation system for the optimum mark feature selection", Proc. SPIE Microlithography, vol. 5375, 2004, pp. 105-113
-
(2004)
Proc. SPIE Microlithography
, vol.5375
, pp. 105-113
-
-
Sato, T.1
-
12
-
-
0141611995
-
Performance study of new segmented overlay marks for advanced wafer processing
-
M. Adel et al, "Performance Study of New Segmented Overlay Marks for Advanced Wafer Processing", Proc. SPIE Microlithography, vol. 5038, 2003, pp. 453-463
-
(2003)
Proc. SPIE Microlithography
, vol.5038
, pp. 453-463
-
-
Adel, M.1
-
13
-
-
25144433637
-
Microeconomics of overlay control at the 65nm technology node
-
J.A. Allgair et al, "Microeconomics of Overlay Control at the 65nm Technology Node", ISSM 2003
-
ISSM 2003
-
-
Allgair, J.A.1
-
14
-
-
0035558993
-
Direct measurement of planarization length for copper chemical mechanical planarization (CMP) processes using a large pattern test mask
-
P. Lefevre et al, "Direct measurement of planarization length for copper chemical mechanical planarization (CMP) processes using a large pattern test mask", Materials Research Society (MRS) proceedings 2001
-
Materials Research Society (MRS) Proceedings 2001
-
-
Lefevre, P.1
-
15
-
-
0035742237
-
Modeling of pattern dependencies for multi-level copper chemical-mechanical polishing processes
-
San Francisco, CA, April
-
T. Tugbawa et al, "Modeling of Pattern dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes," Materials Research Society (MRS) Spring Meeting, San Francisco, CA, April 2001.
-
(2001)
Materials Research Society (MRS) Spring Meeting
-
-
Tugbawa, T.1
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