Advances in process overlay-ATHENA™ alignment system performance on critical process layers

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4689 I, Issue , 2002, Pages 397-408

  Laidler, David ^a   Megens, Henry ^b   Lalbahadoersing, Sanjay ^b   Van Haren, Richard ^b   Bornebroek, Frank ^b  

^a IMEC   (Belgium)

^b ASML   (Netherlands)

Author keywords

Alignment; Aluminum; CMP; Contact; Copper; Damascene; Gate; Overlay; STI; Tungsten

Indexed keywords

ALIGNMENT; ALUMINUM; DIELECTRIC MATERIALS; INTEGRATED CIRCUITS; SPUTTERING;

COPPER DUAL DAMASCENE PROCESSING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0036030186     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.473478     Document Type: Article

References (5)

1. J. Neijzen, R. Morton, P. Dirksen, H. Megens, F. Bornebroek, "Improved Wafer Stepper Alignment Performance using an Enhanced Phase Grating Alignment System", Proc. SPIE, Vol. 3677 (1999) pp. 382-394.
2. P. Dirksen, C. Juffermans, A. Leeuwestein, C. Mutsaers, A. Nuijs, R. Pellens, R. Wolters, J. Gemen, "Effect of Processing on the Overlay Performance of a Wafer Stepper", Proc. SPIE, Vol. 3050 (1997) pp. 102-113.
3. R. Navarro, S. Keij, A. den Boef, S. Schets, F. van Bilsen, G. Simons, R. Schuurhuis, J. Burghoorn, "Extended ATHENA Alignment Performance and Application for the 100nm Technology Node", Proc. SPIE, Vol. 4344 (2001) pp. 682-694.
4. F. Bornebroek, J. Burghoorn, J. Greeneich, H. Megens, D. Satriasaputra, G. Simons, S. Stalnaker, B. Koek, "Overlay Performance in Advanced Processes", Proc. SPIE, Vol. 4000 (2000) pp. 520-531.
5. P. Hinnen, H. Megens, M. van der Schaar, R. van Haren, E. Mos, S. Lalbahadoersing, F. Bornebroek, D. Laidler, "Advances in Process Overlay", Proc. SPIE, Vol. 4344 (2001) pp. 114-126.