Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution

Journal of Materials Research

Volumn 22, Issue 9, 2007, Pages 2573-2581

  Mohanty, Udit Surya ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL CORROSION; PASSIVATION; PHASE TRANSITIONS; PITTING; POTENTIODYNAMIC POLARIZATION; SODIUM CHLORIDE; SURFACE ANALYSIS;

ACTIVE-PASSIVE TRANSITION; BREAKDOWN POTENTIAL; CORROSION-CURRENT DENSITY; LINEAR POLARIZATION RESISTANCE;

TIN ALLOYS;

EID: 34748903503     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0328     Document Type: Article

References (46)

1. J.R. Stack: Tin, lead, and tin-lead alloy plating baths. U.S. Patent No. 2313371, March, 1943.
2. M. Carano: Solderability of bright acid chock deposits (aptitude for the soldering of the brilliant tin coatings in acid medium). Plat. Surf. Finish. 70, 58 (1983).
3. R.G. Baker and T.A. Pulombo: Plat. Surf. Finish. 70, 63 (1983).
4. J.H. Kim, M.S. Suh, and H.S. Kwon: Effects of plating conditions on the microstructure of 80 Sn-20 Pb electrodeposits from an organic sulphonate bath. Surf. Coat. Technol. 78, 56 (1996).
5. Y. Liu and M. Pritzker: Effect of pulse plating on composition of Sn-Pb coatings deposited in fluoroborate solutions. J. Appl. Electrochem. 33, 1143 (2003).
6. European Parliament: Proposal for a Directive of the European Parliament and of the Council on Waste Electripal and Electronic Equipment and the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, (COM 2000), p. 347.
7. Y. Fujiwara, H. Enomoto, T. Nagao, and H. Hoshika: Composite plating of Sn-Ag alloys for Pb-free soldering. Surf. Coat. Technol. 169-170, 100 (2000).
8. J.C. Puippe and W. Fluehmann: Electrodeposition and properties of a silver-tin alloy. Plat. Surf. Finish. 70, 46 (1983).
9. N. Kubota and E. Sato: The properties of silver-tin alloy deposits from pyrophosphate bath. Electrochim. Acta. 30, 305 (1985).
10. S. Arai, H. Akatsuka, and N. Kaneko: Sn-Ag solder bump formation for flip-chip bonding by electroplating. J. Electrochem. Soc. 150, 10 (2003).
11. S. Arai, N. Kaneko, and N. Shinohara: Polarographic study on the smoothing of Sn-Ag alloy film electrodeposited from pyrophosphate iodide bath. Electrochemistry 69, 254 (2001).
12. S. Arai and T. Watanabe: Microstructure of Sn-Ag alloys electrodeposited from pyrophosphate-iodide solutions. Mater. Trans. 39, 439 (1998).
13. O. Khaselev, I.S. Zavarine, A. Vysotskaya, C. Fan, Y. Zhang, and J. Abys: Electroplating and properties of Sn Bi and Sn Cu for lead free finishes. Trans. Inst. Met. Finish. 80, 200 (2002).
14. R.K. Shiue, L.W. Tsay, C.L. Lin, and J.L. Ou: A Study of Sn-Bi-Ag-In lead-free solders. J. Mater. Sci. 38, 1269 (2003).
15. E. Guaus and J. Torrent-Burgues: Tin-zinc electrodeposition from sulphate-gluconate baths. J. Electroanal. Chem. 549, 25 (2003).
16. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang: The properties of Sn-9Zn lead free solder alloys doped with trace rare earth elements. J. Electron. Mater. 31, 921 (2002).
17. K.L. Lin and L.M. Sun: Electrodeposition of eutectic Sn-Zn alloy by pulse plating. J. Mater. Res. 18, 2203 (2003).
18. N. Kaneko, M. Seki, S. Arai, and N. Shinobara: Sn-Cu solder bump formation from acid sulfate baths using electroplating method. Electrochemistry 71, 791 (2003).
19. M. Fukuda, K. Imayoshi, and Y. Matsumoto: Effects of thiourea and polyoxyethylene lauryl ether on electrodeposition of Sn-Ag-Cu alloy as a Ph free solder. J. Electrochem. Soc. 149, C244 (2002).
20. R.K. Shiue, L.W. Tsay, C.L. Lin, and J.L. On: A study of Sn-Bi-Ag-In lead-free solder. J. Mater. Sci. 38, 1269 (2003).
21. T.M. Korhonen and J.K. Kivilahti: Thermodynamics of the Sn-In-Ag solder system. J. Electron. Mat. 27, 149 (1998).
22. JEIDA: Challenges and Efforts Towards Commercialization of Lead-Free Solder Road Map 2000, Ver. 13, (Japan Electronics Industry Development Association, 2000).
23. J. Bath, C. Handweker, and E. Bradley: Research update: lead-free solder alternatives. Circ. Assemb. 11, 5, 30 (2000).
24. J. Zhao, L. Qi, X. Wang, and L. Wang: Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead free solder. J. Alloys Compd. 375, 196 (2004).
25. K.S. Kim, S.H. Huh, and K. Suganuma: Effects of intermetallic compounds on properties of Sn-Ag-Cu lead free soldered joints. J. Alloys Compd. 352, 226 (2003).
26. B.Y. Wu, Y.C. Chan, and M.O. Alain: Electrochemical corrosion study of Pb-free solders. J. Mater. Res. 21, 62 (2006).
27. H. Oulfajrite, A. Sabbar, M. Boulghallat, A. Jouaiti, R. Lbibb, and A. Zrinelli: Electrochemical behavior of a new solder material Sn-In-Ag. Mater. Lett. 57, 4368 (2003).
28. K.I. Chen and K.L. Lin: International Symposium on Electronic Materials and Packaging, Hsinchu, Taiwan. 49 (2002).
29. E. Adem: VG Scientific Auger Handbook, 1st ed. (V.G Scientific Limited, East Grinstead, England, 1989).
30. Corrosion, Vol. 13, 9th Ed., Metals Handbook (ASM International, Metals Park, OH, 1987).
31. H. Tanaka, F. Ueta, S. Yoshihara, and T. Shirakashi: Effects of reflow processing and flux residue on ionic migration of lead-free solder plating using the quartz crystal microbalance method. Mater. Trans. 42(9), 3401 (2001).
32. S.A.M. Refaey and S.S. Abd El-Rehim: Inhibition of chloride pitting corrosion of tin in alkaline and near neutral medium by some inorganic anions. Electrochim. Acta. 42, 667 (1997).
33. J. Kristen: Atlas of metal ligand equilibrium in aqueous solutions. Chester, (1978), p. 623.
34. R. Mishra and R. Balasubramanium: Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel. Corros. Sci. 46, 3019 (2004).
35. 4 solution. Electrochim. Acta 51, 5494 (2006).
36. V.B. Singh and A. Gupta: Active, passive and transpassive dissolution of In-718 alloy in acidic solutions. Mater. Chem. Phys. 85(1), 12 (2004).
37. A. Kolics, J.C. Polkinghorne, and A. Wieckowski: Adsorption of sulfate and chloride ions on aluminium. Electrochim. Acta 43, 2605 (1998).
38. J.A. Ricardson and G.C. Wood: A study of the pitting corrosion of Al by scanning electron microscopy. Corros. Sci. 10, 313 (1970).
39. O. Von Trzebiatowski, J. Janczak, and T. Sutter: Microelectrochemical corrosion studies on lead free Sn-Ag-Cu solder alloys. Oral presentation at E-MRS Fall meeting, 2005.
40. T.C. Chang, M.H. Hou, M.C. Wang, and D.Y. Lin: Electrochemical behaviors of the Sn-9Zn-XAg lead-free solders in a 3.5 wt% NaCl solution. J. Electrochem. Soc. 151(7), C484 (2004).
41. J.F. Moulder, W.F. Stickle, P.E. Sobol, and K.D. Bomben: Handbook of X-Ray Photo Electron Spectroscopy, 2nd Ed. (Perkin Elmer Corporation, Physical Electronics Division, 1992).
42. A. Katayama: Electroxidation of methanol on a platinum-tin oxide catalyst. J. Phys. Chem. 84, 376 (1980).
43. R.O. Ansell, T. Dickinson, A.F. Povey, and P.M.A. Sherwood: X-ray photoelectron spectroscopic studies of tin electrodes after polarization in sodium hydroxide solution. J. Electrochem. Soc. 124(9), 1360 (1977).
44. D. Briggs and M.P. Seah: Practical Surface Analysis, Publication No. 150, Vol. 1, 2nd ed. (John Wiley and Sons 1993).
45. T.J. Chuang, C.R. Brundle, and D.W. Rice: Interpretation of the x-ray photoemission spectra of cobalt oxides and cobalt oxide surfaces. Surf. Sci. 59, 413 (1979).
46. F.M. Amanullah, K.J. Pratap, and V. Hari Babu: Compositional analysis and depth profile studies on undoped and doped tin oxide films prepared by spray technique. Mater. Sci. Eng., A B52, 93 (1998).