Electroplating and properties of SnBi and SnCu for lead-free finishes

Transactions of the Institute of Metal Finishing

Volumn 80, Issue 6, 2002, Pages 200-204

  Khaselev, O ^a,b   Zavarine, I S ^a,b   Vysotskaya, A ^a,b   Fan, C ^a,b   Zhang, Y ^a,c   Abys, J ^a,b  

^a NOKIA RESEARCH CENTER   (United States)

^b Enthone Inc   (United States)

^c Technic Advanced Technology Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ELECTROCHEMISTRY; METAL FINISHING; TIN ALLOYS;

ALLOY CONTROL;

ELECTROPLATING;

EID: 0036862767     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2002.11871468     Document Type: Article

References (6)

1. E. Bradley, K. Snowdown, and R. Gedney, "Lead-free Update", Circuits Assembly, December 1999, 31.
2. H. Nawafune, K. Ikeda, K. Shiba, S. Mizumoto, T. Takeuchi and K. Aoki, Hyomen Gijutsu 1999, 50(10), 923-927.
3. M. Fukuda, K. Hirakawa, and Y. Matsumoto, Hyomen Gijutsu 1999, 50(12), 1125-1129.
4. T. Kondo, K. Obata, T. Takeuchi, and S. Masaki, Plat. Surf. Finish. 1998, 85(2), 51-55.
5. S.A. Maksimenko, V.N. Kudrjavtsev, K.M. Tutina, A.N. Popov and R.A. Gerasimov, Soviet Electrochem., 1990, 26(12) 1375-1532.
6. C. Fan, Y. Zhang and J. Abys, in AESF Proceedings, Nashville, 2001.