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Journal of Applied Electrochemistry

Volumn 33, Issue 12, 2003, Pages 1143-1153

Effect of pulse plating on composition of Sn-Pb coatings deposited in fluoroborate solutions

(2) Liu, Yongdong a Pritzker, Mark a

a UNIVERSITY OF WATERLOO (Canada)

Author keywords

Electrodeposition; Fluoroborate; Pulse reverse; Pulsed current; Tin lead alloy

Indexed keywords

COMPOSITION; COPPER; CURRENT DENSITY; DISSOLUTION; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRODEPOSITION; ELECTRODES; LEAD; MASS TRANSFER; REACTION KINETICS; ROTATING DISKS; SOLUTIONS; TIN;

CATHODIC POLARIZATION; ELECTRODEPOSITION KINETICS;

COATINGS;

EID: 0344552930 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/B:JACH.0000003850.61488.83 Document Type: Article

Times cited : (19)

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