Electrodeposition of eutectic Sn-Zn alloy by pulse plating

Journal of Materials Research

Volumn 18, Issue 9, 2003, Pages 2203-2207

  Lin, Kwang Lung ^a   Sun, Li Min ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; CURRENT DENSITY; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRODEPOSITION; ELECTROPLATING; EUTECTICS; SCANNING ELECTRON MICROSCOPY; TEMPERATURE;

COMPOSITION DISTRIBUTION; GLOW DISCHARGE SPECTROSCOPY; PULSE DEPOSITION; PULSE PLATING; TIN ZINC ALLOYS;

TIN ALLOYS;

EID: 0141816569     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0307     Document Type: Article

References (16)

1. V.S. Vasanthan, M. Pushbavanam, and V.S. Muralidharan, Plat. Surf. Finish. 82, 81 (1995).
2. E. Budman and D. Stevens, Anti-Corrosion Methods Mater. 45, 327 (1998).
3. O.A. Ashiru and J. Shirokoff, Appl. Surf. Sci. 103, 159 (1996).
4. E. Budman and D. Stevens, Product Finish. 51, 6 (1998).
5. D. Crotty and R. Griffin, Plat. Surf. Finish. 84, 57 (1997).
6. H. Nawafune, K. Ikeda, S. Mizumoto, T. Takeuchi, and K. Aoki, J. Surf. Finish. Soc. Jpn. 48, 1007 (1997).
7. G.I. Medvedev and V.I. Zhuravlev, Russ. J. Appl. Chem. 69, 1333 (1996).
8. V.S. Vasantha, M. Pushpavanam, and V.S. Muralidharan, Proc. Indian Acad. Sci., Chem. Sci. 107, 581 (1995).
9. V.S. Vasantha, M. Pushpavanam, and V.S. Muralidharan, Metal Finish. 94, 60 (1996).
10. L. Jacobs, U.K. Patent No. GB2266894 (17 November 1993).
11. V.S. Vasantha, M. Pushpavanam, P. Kamaraj, and V.S. Muralidharan, Trans. Inst. Metal Finish. 74, 28 (1996).
12. M. Hansen, Constitution of Binary Alloys, 2nd ed. (McGraw-Hill, New York, 1989), p. 1218.
13. A. Brenner, Electrodeposition of Alloy (Academic Press, New York, 1963).
14. D. Landolt, Electrochim. Acta 39, 1075 (1994).
15. J.-Cl. Puippe, in Theory and Practice of Pulse Plating, edited by J-Cl. Puippe and F. Leaman (American Electroplaters and Surface Finishers Society, Orlando, FL, 1986), Chapter 3.
16. D. Landolt, in Theory and Practice of Pulse Plating, edited by J-Cl. Puippe and F. Leaman (American Electroplaters and Surface Finishers Society, Orlando, FL, 1986), Chapter 5.