Sn-Cu Solder Bump Formation from Acid Sulfate Baths Using Electroplating Method

Electrochemistry

Volumn 71, Issue 9, 2003, Pages 791-794

  Kaneko, Norio ^a   Seki, Masako ^a   Arai, Susumu ^a   Shinohara, Naoyuki ^a  

^a SHINSHU UNIVERSITY   (Japan)

Author keywords

Electroplating; Pb free Solder; Sn Cu Alloy Bump

Indexed keywords

AMINES; COPPER ALLOYS; ELECTROPLATING; SULFUR COMPOUNDS;

GALVANOSTATICS;

TIN ALLOYS;

EID: 0142062152     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.71.791     Document Type: Article

References (12)

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