Electrochemical behaviors of the Sn-9Zn-xAg lead-free solders in a 3.5 wt % NaCl solution

Journal of the Electrochemical Society

Volumn 151, Issue 7, 2004, Pages

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b   Lin, Dong Yih ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DIFFRACTOMETERS; DUCTILITY; ELECTROCHEMISTRY; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; SOLIDIFICATION; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

LEAD-FREE SOLDERS; SALT-SPRAY TESTS; SOLDER ALLOYS; X-RAY DIFFRACTOMETERS;

SOLDERING ALLOYS;

EID: 3242699047     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1756890     Document Type: Article

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