Role of electrode potential difference between lead-free solder and copper base metal in wetting

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1784-1790

  Takemoto, Tadashi ^a   Funaki, Tatsuya ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Contact angle; Contact current; Contact polarization; Electrode potential; Lead free solder; Spread test; Wetting

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; POLARIZATION; SOLDERING; WETTING;

CONTACT POLARIZATION; POTENTIAL DIFFERENCE;

SOLDERING ALLOYS;

EID: 0036698703     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1784     Document Type: Article

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