Shear fracture behavior on ball grid arrayed tin-silver-copper solder/pure copper pad joint interface

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2372-2379

  Noguchi, Kunihiro ^a   Endou, Yuya ^b   Shimizu, Isao ^b   Ohno, Yasuhide ^b  

^a KUMAMOTO NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b KUMAMOTO UNIVERSITY   (Japan)

Author keywords

Intermetallic compound; Pure copper pad; Reflow process; Shear strength; Tin lead silver ball

Indexed keywords

JOINT STRENGTH; PURE COPPER PAD; REFLOW PROCESS; TIN-LEAD-SILVER BALL;

COMPOSITION; COPPER; FRACTURE; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); MORPHOLOGY; SHEAR STRENGTH; TIN ALLOYS;

SOLDERING;

EID: 30844442818     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2372     Document Type: Article

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