Refrigeration by combined tunneling and thermionic emission in vacuum: Use of nanometer scale design

Applied Physics Letters

Volumn 78, Issue 17, 2001, Pages 2572-2574

  Hishinuma, Y ^a   Geballe, T H ^a   Moyzhes, B Y ^a   Kenny, T W ^b  

^a STANFORD UNIVERSITY   (United States)

^b Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035938301     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1365944     Document Type: Article

References (12)

1. F. J. DiSalvo, Science 285, 703 (1999).
2. D. Chung, T. Hogan, P. Brazis, M. Rocci-Lane, C. Kannewurf, M. Bastea, C. Uher, and M. G. Kanatzidis, Science 287, 1024 (2000).
3. G. D. Mahan, J. Appl. Phys. 76, 4362 (1994).
4. A. N. Korotkov and K. K. Likharev. Appl. Phys. Lett. 75, 2491 (1999).
5. 2 deposited at the anode. Our approach can reduce this deposited energy by more than a factor of 10, because we can operate with less than a 2 V bias for the same current density.
6. S. Å. Lindgren and L. Walldén, Phys. Rev. B 22, 5967 (1980).
7. G. G. Magera and P. R. Davis, J. Vac. Sci. Technol. A 11, 2336 (1993).
8. A. H. Sommer, Photoemissive Materials (Krieger, New York, 1980).
9. V. S. Fomenko, Handbook of Thermionic Properties (Plenum, New York, 1966).
10. R. H. Fowler, Statistical Mechanics, 2nd ed. (Cambridge University Press, London, 1936), p. 342.
11. It should be noted that calculations of tunneling through vacuum are more accurate than tunneling through dielectric films because there are no local resonant levels in vacuum, and there is no uncertainty in electron mass and dielectric constant.
12. T. W. Kenny, J. K. Reynolds, J. A. Podosek, E. C. Vote, L. M. Miller, H. K. Rockstad, and W. J. Kaiser, Rev. Sci. Instrum. 67, 112 (1996).