Effect of current stressing on the reliability of 63Sn37Pb solder joints

Journal of Materials Science

Volumn 42, Issue 17, 2007, Pages 7415-7422

  Wu, B Y ^a   Chan, Y C ^a   Zhong, H W ^a   Alam, M O ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CURRENTS; GRAIN BOUNDARIES; INTERFACES (MATERIALS); MICROSTRUCTURE;

CURRENT FLOW; CURRENT STRESSING; INTERFACIAL REACTION;

SOLDERED JOINTS;

EID: 34547438225     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-007-1836-y     Document Type: Article

References (28)

1. Brandenburg S, Yeh S, in Proceedings of the Surface Mount International Conference and Exhibition, SMI98, San Jose, CA, August (SMTA, Edina, MN, 1998), p 337
2. Tu KN (2003) J Appl Phys 94:5451
3. Lee TY, Tu KN (2001) J Appl Phy 90:4502
4. Tang Z, Shi FG (2001) Microelectron J 32:605
5. Rinne GA (2003) Microelectron Reliab 43:1975
6. Hsu YC, Shao TL, Yang CJ, Chen C (2003) J Electron Mate 132:1222
7. Nah JW, Kim JH, Lee HM, Paik KW (2004) Acta Mater 52:129
8. Ye H, Basaran C, Hopkins DC (2003) Int J Solids Struct 40:4021
9. Kumar A, He M, Chen Z, Teo PS (2004) Thin Solid Films 462463:413
10. Everett YCC, Choi WJ, Tu KN (2002) Appl Phys Lett 80:580
11. Lai YS, Kao CL (2006) Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectron Reliab, In Press, Available online 10 January 2006
12. Wu JD, Zheng PJ, Lee CW, Hung SC, Lee JJ (2006) Microelectron and Reliab 46:41
13. Chiew HT (2004) Effect of Ni and Cu additive on electromigration in Sn solder joints and lines. Master Thesis, Department of Chemical and Materials Engineering, National Central University Chung-Li, Taiwan, June, 2004
14. Liu YH, Lin KL (2005) J Mater Res 20:2184
15. Chen SW, Chen CM (2003) JOM-J Mineral Metal Mater Soc 55:62
16. Hu YC, Lin YH, Kao CR (2003) J Mater Res 18:2544
17. Alam MO, Wu BY, Chan YC, Tu KN (2006) Acta Mater 54:613
18. Ye H, Basaran C, Hopkins D (2004) Int J Solid Struct 41:2743
19. Roush W, Jaspai J (1982) In: Proceedings of the 32nd Electronic Components Conference, San Diego, CA, vol. 32, pp. 342-345
20. Ye H, Basaran C, Hopkins DC (2003) Appl Phys Lett 82:1045
21. Huang AT, Gusak AM, Tu KN (2006) Appl Phys Lett 88, 141911:1-3
22. Lin YH, Tsai CM, Hu YC, Lin YL, Kao CR (2005) J Electron Mater 34:27
23. Wu BY, Chan YC (2005) J Alloys Compds 392:237
24. Mei Z, Sunwoo A, Morris JW (1992) Metallur Trans A 23A:857
25. Jung K, Conrad H (2001) J Electron Mater 30:1038
26. Roming AD, Chang JRYA, Stephens JJ, Frear DR, Marcotte V, Lea C (1991) In: Frear DR, Jones WJ, Kinsman KR (eds) Solder mechanics-A state of the art assessment. The Minerals, Metals and Materials Society, Warrendale, PA, USA, p 54
27. Parkash KH, Sritharan T (2003) J Electron Mater 32:939
28. Ghosh G (2000) Acta Mater 48:3719