Process variation aware OPC with variational lithography modeling

Proceedings - Design Automation Conference

Volumn , Issue , 2006, Pages 785-790

  Yu, Peng ^a   Shi, Sean X ^a   Pan, David Z ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Lithography modeling; OPC; Process variation

Indexed keywords

CIRCUIT SIMULATION; ERROR CORRECTION; LITHOGRAPHY; MATHEMATICAL MODELS;

LITHOGRAPHY MODELING; OPTICAL PROXIMITY CORRECTION (OPC); PROCESS VARIATION; VARIATIONAL EDGE PLACEMENT ERROR (V-EPE) METRICS;

OPTICAL RESOLVING POWER;

EID: 34547204694     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1146909.1147108     Document Type: Conference Paper

References (25)

1. M. Born and E. Wolf. Principles of Optics : Electromagnetic Theory of Propagation, Interference and Diffraction of Light. 7 edition.
2. A. Borna, C. Progler, and D. Blaauw. Correlation analysis of CD-variation and circuit performance under multiple sources of variability. In Proc. SPIE 5756, pages 168-177, May 2005.
3. N. Cobb and Y. Granik. New concepts in OPC. In Proc. SPIE 5377, pages 680-690, 2004.
4. N. B. Cobb. Fast Optical and Process Proximity Correction Algorithms for Integrated Circuit Manufacturing. PhD thesis, University of California at Berkeley, 1998.
5. N. B. Cobb and Y. Granik. OPC methods to improve image slope and process window. In Proc. SPIE 5042, pages 116-125, 2003.
6. D. Fuard, M. Besacier, and P. Schiavone. Assessment of different simplified resist models. In Proc. SPIE 4691, pages 1266-1277, 2002.
7. D. Fuard, M. Besacier, and P. Schiavone. Validity of the diffused aerial image model: an assessment based on multiple test cases. In Proc. SPIE 5040, pages 1536-1543, 2003.
8. Y. Granik and N. B. Cobb. MEEF as a matrix. In Proc. SPIE 4562, pages 980-991, 2002.
9. P. Gupta and F-L. Heng. Toward a systematic-variation aware timing methodology. In Proc. Design Automation Conference, pages 321-326, 2004.
10. P. Gupta, A. B. Kahng, C-H. Park, K. Samadi, and X. Xu. Wafer topography-aware optical proximity correction for better DOF margin and CD control. In Proc. SPIE 5853, pages 844-854, 2005.
11. KLA-Tencor. PROLITH version 9.2.
12. L. Liebmann. Layout impact of resolution enhancement techniques: Impediment or opportunity? In Proc. International Symposium on Physical Design, pages 110-117, 2003.
13. C. A. Mack. Personal communication.
14. C. A. Mack. Inside PROLITH: A Comprehensive Guide to Optical Lithography Simulation. 1997.
15. J. Mitra, P. Yu, and D. Z. Pan. RADAR: RET-aware detailed routing using fast lithography simulations. In Proc. Design Automation Conference, pages 369-372, 2005.
16. R. F. Pease. Lithographic technologies that haven't (yet) made It: lessons learned (Plenary Paper). In Proc. SPIE 5751, pages, 15-25, 2005.
17. C. J. Progler, A. Borna, D. Blaauw, and P. Sixt. Impact of lithography variability on statistical timing behavior. In Proc. SPIE, pages 101-110, 2004.
18. C. Spence. Full-chip lithography simulation and design analysis: how OPC is changing IC design. In Proc. SPIE 5751, pages 1-14, 2005.
19. J. L. Sturtevant, J. A. Torres, J. Word, Y. Granik, and P. LaCour. Considerations for the use of defocus models for OPC. In Proc. SPIE 5756, pages 427-436, 2005.
20. J. L. Sturtevant, J. Word, P. LaCour, J. W. Park, and D. Smith. Assessing the impact of real world manufacturing lithography variations on post-OPC CD control. In Proc. SPIE 5756, pages 240-254, 2005.
21. Y.-T. Wang, Y. C. Pati, and T. Kailath. Depth of focus and the moment expansion. OPTICS LETTERS, 20(18):1841-1843, Sept. 1995.
22. A. K. Wong. Microlithography: Trends, challenges, solutions, and their impact on design. IEEE Micro, 23(2):12-21, 2003.
23. A. K.-K. Wong. Resolution Enhancement Techniques in Optical Lithography. 2001.
24. J. Yang, L. Capodieci, and D. Sylvester. Advanced timing analysis based on post-opc extraction of critical dimensions. In Proc. Design Automation Conference, pages 359-364, 2005.
25. P. Yu, D. Z. Pan, and C. A. Mack. Fast lithography simulation under focus variations for OPC and layout optimizations. In Proc. SPIE 6156, pages 397-406, 2006.